XC5VLX110-1FF1153I
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 4718592 110592 1153-BBGA, FCBGA |
|---|---|
| Quantity | 1,701 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1153-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1153-BBGA, FCBGA | Number of I/O | 800 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8640 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4718592 |
Overview of XC5VLX110-1FF1153I – Virtex®-5 LX FPGA, 1153-FCBGA
The XC5VLX110-1FF1153I is a Virtex®-5 LX field programmable gate array (FPGA) IC designed for applications requiring high logic capacity and significant on‑chip memory. It provides 110,592 logic elements, approximately 4.72 Mbits of embedded RAM, and up to 800 I/O connections in a compact FCBGA package.
Manufactured for industrial use, the device supports a supply voltage range of 950 mV to 1.05 V and an operating temperature range of –40 °C to 100 °C. The package and electrical characteristics make it suitable for dense, performance-oriented board designs while meeting RoHS compliance.
Key Features
- Core Logic 110,592 logic elements provide substantial on-chip programmable resources for complex digital designs and custom hardware implementations.
- Embedded Memory Approximately 4.72 Mbits of on-chip RAM (4,718,592 total RAM bits) for buffering, local data storage, and state retention within logic fabric.
- I/O Capacity Up to 800 I/O pins enable broad peripheral and interface support for multi-channel or multi-domain systems.
- Package and Mounting Surface-mount 1153-FCBGA package (35 × 35 mm) / 1153-BBGA offering a high-density footprint for space-constrained PCBs.
- Power Core supply range of 950 mV to 1.05 V to match system power supply architectures and optimize logic performance.
- Temperature and Grade Industrial grade device with an operating temperature range of –40 °C to 100 °C for deployment in a wide range of environments.
- Environmental Compliance RoHS compliant for alignment with environmental and regulatory requirements.
Typical Applications
- High-density I/O systems Use the device's 800 I/O connections to consolidate multiple interfaces and external peripherals on a single FPGA.
- Memory‑intensive logic Leverage approximately 4.72 Mbits of embedded RAM for packet buffering, local caching, or intermediate data storage within custom accelerators.
- Industrial control and automation Industrial-grade temperature range and robust packaging support deployment in factory automation and process-control equipment.
- Large-scale logic integration 110,592 logic elements accommodate complex state machines, signal processing pipelines, and multi-function system integration on one device.
Unique Advantages
- Highly integrated logic capacity: 110,592 logic elements reduce the need for multiple FPGAs or external glue logic, simplifying system architecture.
- Substantial on-chip RAM: Approximately 4.72 Mbits of embedded memory supports local buffering and data-path optimization without relying entirely on external memory.
- Extensive I/O resources: 800 available I/O pins enable versatile interfacing for complex multi-channel designs and mixed-signal front ends.
- Industrial temperature support: Rated for –40 °C to 100 °C to address demanding environmental conditions common in industrial deployments.
- Compact, high-density packaging: The 1153-FCBGA (35×35) package delivers a dense footprint suited to space-conscious PCB layouts.
- RoHS compliant: Meets lead-free and restricted substance requirements for environmentally conscious designs.
Why Choose XC5VLX110-1FF1153I?
The XC5VLX110-1FF1153I balances large-scale programmable logic, embedded memory, and high I/O capacity in a single industrial-grade FPGA package. Its combination of 110,592 logic elements, approximately 4.72 Mbits of on-chip RAM, and 800 I/O pins provides designers with the raw resources needed to integrate complex functions and reduce external component count.
This device is suited for teams and projects that require scalable logic resources, substantial on-chip memory, and reliable operation across a wide temperature range. The compact 1153-FCBGA package and RoHS compliance further support modern board designs and regulatory alignment.
Request a quote or submit a sales inquiry to obtain pricing, lead-time, and availability for the XC5VLX110-1FF1153I. Our team can assist with ordering details and delivery options.

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