XC5VFX70T-2FFG665C

The XC5VFX70T-2FFG665C is a Virtex®-5 FXT field programmable gate array (FPGA) in a 665-ball FCBGA package. It provides a large logic capacity with substantial on-chip RAM and a high I/O count for designs that require dense, reconfigurable logic integration.

This commercial-grade, surface-mount device operates from 950 mV to 1.05 V and across an ambient range of 0 °C to 85 °C, and is RoHS compliant.

Key Features

• Core Logic 71,680 logic elements organized with 5,600 CLBs (configurable logic blocks) to implement complex digital functions.
• Embedded Memory Approximately 5.46 Mbits of on-chip RAM for buffering, packet processing, and embedded data structures.
• I/O Capacity Up to 360 user I/Os to support wide bus interfaces and multiple peripheral connections.
• Power Core supply range of 950 mV to 1.05 V, enabling precise power budgeting for the FPGA core.
• Package & Mounting 665-FCBGA (27×27) package in a 665-BBGA form factor, designed for surface-mount assembly.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• High-density logic integration Use the device where large numbers of logic elements and CLBs are required to implement complex control or processing functions.
• Memory-intensive designs Leverage approximately 5.46 Mbits of embedded RAM for packet buffering, lookup tables, or temporary storage in data-path applications.
• I/O-rich systems Deploy in systems needing many external connections—up to 360 I/Os—for interfacing with sensors, peripherals, or wide buses.

Unique Advantages

• Substantial logic capacity: 71,680 logic elements and 5,600 CLBs provide room for sizable, multi-function designs without immediate partitioning across multiple devices.
• On-chip memory resources: Approximately 5.46 Mbits of RAM reduce reliance on external memory for many buffering and temporary data needs.
• High I/O density: 360 I/Os simplify board routing by concentrating numerous interfaces on a single device.
• Compact BGA package: 665-FCBGA (27×27) supports high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial operating range: 0 °C to 85 °C aligns with standard commercial electronics environments.
• RoHS compliant: Meets lead-free assembly requirements for regulated markets.

Why Choose XC5VFX70T-2FFG665C?

The XC5VFX70T-2FFG665C positions itself as a high-capacity, single-FPGA solution for designs that need extensive logic resources, significant on-chip memory, and many external interfaces. Its combination of 71,680 logic elements, approximately 5.46 Mbits of embedded RAM, and 360 I/Os enables consolidation of complex functions into one device.

With a 665-FCBGA (27×27) surface-mount package, defined core voltage range, commercial temperature rating, and RoHS compliance, this FPGA is suitable for commercial electronic products requiring dense, reconfigurable logic and embedded memory in a compact form factor.

Request a quote or submit an inquiry to receive pricing and availability information for the XC5VFX70T-2FFG665C.