XC5VLX110-1FF1760C

The XC5VLX110-1FF1760C is a Virtex‑5 LX field programmable gate array (FPGA) from AMD, supplied in a 1760‑ball FCBGA package for surface‑mount assembly. It delivers a high logic capacity platform with substantial embedded memory and a large I/O count, targeted for commercial applications and complex digital designs.

With 110,592 logic elements, approximately 4.7 Mbits of on‑chip RAM and up to 800 I/Os, this device supports dense logic implementation and extensive external interfacing while operating across a commercial temperature range and a core supply window of 950 mV to 1.05 V.

Key Features

• Core Logic 110,592 logic elements provide the capacity to implement large, parallel hardware functions and complex logic architectures.
• Embedded Memory Approximately 4.7 Mbits of on‑chip RAM for data buffering, FIFOs and local storage to support high‑throughput designs.
• I/O Density Up to 800 user I/O pins to support multiple interfaces, bus widths and external peripherals.
• Package 1760‑ball FCBGA (42.5 × 42.5 mm) surface‑mount package for high‑density PCB integration.
• Power Core supply operating range from 950 mV to 1.05 V to match system power rails and regulator designs.
• Temperature and Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Commercial embedded systems — Implements custom digital processing and control logic where high logic density and on‑chip memory are required.
• High‑I/O interface bridging — Supports designs that require extensive external device interfacing and wide parallel buses using up to 800 I/Os.
• Prototyping and development platforms — Provides a flexible, high‑capacity FPGA fabric for validation and functional prototyping of complex digital subsystems.

Unique Advantages

• High logic capacity: 110,592 logic elements enable implementation of large, feature‑rich designs without immediate need for multiple devices.
• Substantial embedded memory: Approximately 4.7 Mbits of on‑chip RAM reduces external memory dependence and simplifies board design for buffering and state storage.
• Large I/O complement: Up to 800 I/Os allow flexible interfacing to multiple peripherals, buses and daughter cards.
• Compact, manufacturable package: 1760‑ball FCBGA in a 42.5 × 42.5 mm footprint supports high‑density PCB layouts and surface‑mount assembly processes.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match a wide range of commercial product environments.
• RoHS compliant: Meets common environmental compliance requirements for electronic assemblies.

Why Choose XC5VLX110-1FF1760C?

The XC5VLX110-1FF1760C positions itself as a high‑capacity Virtex‑5 LX FPGA option for commercial designs that require extensive logic resources, embedded memory and broad I/O connectivity in a single device. Its combination of 110,592 logic elements, approximately 4.7 Mbits of on‑chip RAM and up to 800 I/Os makes it suitable for complex digital implementations and interface‑rich systems.

Engineers and procurement teams looking for a commercially graded FPGA with a compact 1760‑ball FCBGA package, defined supply voltage window and RoHS compliance will find this device appropriate for scalable designs that balance integration density and manufacturability.

If you would like pricing, availability or a formal quote for the XC5VLX110-1FF1760C, submit a request to receive a quote or additional procurement information.