XC5VLX110-1FFG1153CES
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 4718592 110592 1153-BBGA, FCBGA |
|---|---|
| Quantity | 1,196 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1153-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1153-BBGA, FCBGA | Number of I/O | 800 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8640 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4718592 |
Overview of XC5VLX110-1FFG1153CES – Virtex®-5 LX FPGA, 110,592 Logic Elements, 1153-FCBGA
The XC5VLX110-1FFG1153CES is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD. It provides a high density of programmable logic and on-chip memory combined with a large I/O count in a 1153-ball FCBGA package for commercial-grade applications.
Key on-chip resources include 110,592 logic elements, approximately 4.72 Mbits of embedded memory, and 800 user I/O pins, enabling complex digital designs that require substantial logic, memory, and connectivity within a surface-mount 35 × 35 mm package.
Key Features
- Core Logic 110,592 logic elements to implement large-scale digital designs and custom logic functions.
- Embedded Memory Approximately 4.72 Mbits of on-chip RAM for buffering, temporary storage, and memory-intensive algorithms.
- I/O Capacity 800 user I/O pins to support wide parallel interfaces and high-pin-count connectivity.
- Power Core supply range specified at 0.95 V to 1.05 V to match system power budgets and regulator designs.
- Package 1153-ball BGA (FCBGA) in a 35 × 35 mm supplier device package for high-density board integration and surface-mount assembly.
- Operating Conditions Commercial-grade temperature range from 0 °C to 85 °C to support standard commercial electronics environments.
- Compliance RoHS compliant, meeting standard material restrictions for commercial electronic manufacturing.
Typical Applications
- Commercial embedded systems Use the device to implement custom digital logic, protocol handling, and peripheral interfaces where a commercial temperature grade is appropriate.
- High-density I/O designs Integrate multiple parallel interfaces or multi-channel data paths leveraging the 800 available I/O pins.
- Memory-supported processing Deploy designs requiring substantial on-chip buffering or temporary storage using approximately 4.72 Mbits of embedded RAM.
Unique Advantages
- High logic capacity: 110,592 logic elements provide the scale to consolidate multiple functions into a single FPGA, reducing board-level component count.
- Substantial on-chip memory: Approximately 4.72 Mbits of embedded RAM minimizes dependency on external memory for many buffering and data-path needs.
- Extensive I/O: 800 I/O pins enable broad connectivity options for parallel interfaces, multi-channel systems, and dense front-end designs.
- Compact FCBGA package: 1153-ball FCBGA in a 35 × 35 mm footprint supports high-density PCB layouts while remaining surface-mount compatible.
- Commercial-ready performance: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial electronic products.
Why Choose XC5VLX110-1FFG1153CES?
The XC5VLX110-1FFG1153CES positions itself as a high-capacity Virtex®-5 LX FPGA option for commercial designs that require large programmable logic resources, significant on-chip memory, and a very high I/O count. Its combination of 110,592 logic elements, approximately 4.72 Mbits of embedded RAM, and 800 I/O pins makes it well suited for consolidated digital systems where board space and integration are priorities.
With a 1153-ball FCBGA (35 × 35 mm) surface-mount package, a defined core voltage range of 0.95–1.05 V, and a commercial temperature rating, this device offers a reliable platform for designers seeking scalable logic density and connectivity in commercial electronic products.
Request a quote or submit a part request to get pricing and availability for XC5VLX110-1FFG1153CES. Our team will respond with delivery and ordering information tailored to your needs.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








