XC5VLX110-1FFG1760CES

IC FPGA 800 I/O 1760FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 4718592 110592 1760-BBGA, FCBGA

Quantity 481 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O800Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8640Number of Logic Elements/Cells110592
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4718592

Overview of XC5VLX110-1FFG1760CES – Virtex®-5 LX Field Programmable Gate Array (FPGA) IC

The XC5VLX110-1FFG1760CES is a Virtex®-5 LX field programmable gate array manufactured by AMD, supplied in a 1760-ball FCBGA package (42.5 × 42.5 mm). It provides a high-density programmable fabric with 110,592 logic elements and approximately 4.72 Mbits of embedded memory to support complex digital designs with extensive I/O.

Designed for surface-mount board-level integration, this commercial-grade device supports up to 800 I/O pins and operates from a core voltage range of 0.95 V to 1.05 V with an ambient operating temperature range of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

  • Core Logic 110,592 logic elements (cells) provide a large programmable fabric for implementing complex state machines, datapaths and custom logic functions.
  • Embedded Memory Approximately 4.72 Mbits of on-chip RAM to store buffers, FIFOs, lookup tables and other data structures without external memory.
  • I/O Capacity Up to 800 I/O pins enable wide parallel interfaces, dense connectivity to peripherals, sensors and external devices.
  • Power Core supply voltage range of 0.95 V to 1.05 V for integration with regulated power delivery designs.
  • Package and Mounting 1760-FCBGA package (42.5 × 42.5 mm) in a surface-mount form factor suitable for compact, high-density PCB layouts.
  • Temperature and Grade Commercial grade operation from 0 °C to 85 °C for standard commercial and industrial environment deployments.
  • Environmental Compliance RoHS compliant to support lead-free manufacturing processes.

Typical Applications

  • High-density digital processing — Leverage 110,592 logic elements and on-chip RAM for custom datapaths, signal processing blocks and parallel compute tasks.
  • Interface aggregation — Use up to 800 I/O pins to consolidate multiple sensor, peripheral or bus interfaces into a single programmable device.
  • Prototyping and system validation — The combination of large logic capacity and embedded memory makes the device suitable for hardware prototyping of complex digital systems.
  • Embedded control and glue logic — Implement control engines, protocol bridges and timing-critical logic using the device’s programmable fabric and plentiful I/O.

Unique Advantages

  • Large programmable capacity: 110,592 logic elements enable implementation of complex designs without partitioning across multiple devices.
  • Substantial on-chip memory: Approximately 4.72 Mbits of embedded RAM reduce dependency on external memory components and simplify board design.
  • Extensive connectivity: Up to 800 I/Os support high pin-count interfaces and parallel signal routing for demanding system architectures.
  • Surface-mount FCBGA packaging: 1760-ball FCBGA (42.5 × 42.5 mm) balances high I/O density with a compact footprint for modern PCBs.
  • Commercial temperature range: Rated for 0 °C to 85 °C operation to meet standard commercial application requirements.
  • RoHS compliant: Supports lead-free manufacturing and environmental compliance requirements.

Why Choose XC5VLX110-1FFG1760CES?

The XC5VLX110-1FFG1760CES positions itself as a high-capacity Virtex®-5 LX FPGA option for engineers needing substantial logic resources, embedded memory and large I/O counts in a surface-mount FCBGA package. Its combination of 110,592 logic elements, approximately 4.72 Mbits of on-chip RAM and up to 800 I/O pins makes it suitable for complex digital designs, interface consolidation and hardware prototyping under commercial temperature conditions.

This AMD-manufactured device offers designers a scalable programmable platform that simplifies BOM and board complexity by integrating logic, memory and extensive I/O. Its RoHS compliance and defined electrical and thermal operating ranges help support reproducible production and long-term deployment in commercial products.

Request a quote or submit an inquiry to receive pricing, availability and technical support for XC5VLX110-1FFG1760CES.

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