XC5VLX110-1FFG676C

IC FPGA 440 I/O 676FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 4718592 110592 676-BBGA, FCBGA

Quantity 329 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O440Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8640Number of Logic Elements/Cells110592
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4718592

Overview of XC5VLX110-1FFG676C – Virtex®-5 LX FPGA, 676-FCBGA

The XC5VLX110-1FFG676C is a Virtex-5 LX field programmable gate array (FPGA) IC from AMD, provided in a 676-ball FCBGA package. It delivers a high density of programmable logic, on‑chip memory and I/O for commercial electronic designs that require configurable hardware integration and system-level flexibility.

Key Features

  • Logic Capacity — Contains 110,592 logic elements to implement complex custom logic and wide combinational/sequential designs.
  • Configurable Logic Blocks — High-density programmable fabric suitable for large-scale integration and multi-function designs.
  • Embedded Memory — Approximately 4.72 Mbits of on-chip RAM to support data buffering, state storage, and local memory requirements.
  • I/O Resources — 440 user I/O pins to support broad connectivity options and multiple parallel interfaces.
  • Power and Core Voltage — Core supply range from 0.95 V to 1.05 V for nominal operation within specified voltage window.
  • Package — 676-ball FCBGA (676-FCBGA, 27 × 27) surface-mount package for compact board-level integration.
  • Operating Conditions — Commercial grade operation from 0 °C to 85 °C suitable for standard commercial applications.
  • Compliance — RoHS‑compliant for regulatory and environmental considerations.

Typical Applications

  • Custom signal processing — Implement complex DSP pipelines and data-path logic using the device's 110,592 logic elements and embedded RAM.
  • Prototyping and hardware acceleration — Reconfigurable fabric enables hardware prototypes and acceleration of compute tasks in commercial systems.
  • High-density I/O bridging — Use the 440 I/O pins to interface between multiple peripherals, sensors, or parallel data streams.
  • System integration — Combine logic, memory, and I/O in a single FPGA to reduce component count and simplify board design.

Unique Advantages

  • High logic density: 110,592 logic elements provide capacity for complex, large-scale designs without immediate need for external logic.
  • Substantial on-chip memory: Approximately 4.72 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
  • Extensive I/O: 440 I/O pins enable broad peripheral connectivity and flexible system interfacing.
  • Compact FCBGA package: 676-ball (27 × 27) FCBGA package offers a space-efficient footprint for board-level integration.
  • Commercial temperature rating: Rated for 0 °C to 85 °C, aligning with many standard commercial product environments.
  • RoHS-compliant: Meets RoHS requirements to support environmentally compliant product designs.

Why Choose XC5VLX110-1FFG676C?

The XC5VLX110-1FFG676C positions itself as a high‑capacity, commercially graded FPGA suitable for engineers building complex programmable systems. Its combination of 110,592 logic elements, approximately 4.72 Mbits of embedded memory, and 440 I/Os enables consolidation of logic, buffering, and peripheral interfacing into a single device.

This device is a practical choice for commercial applications that require configurable hardware, significant on-chip resources, and a compact FCBGA package. Its defined operating voltage range, RoHS compliance, and commercial temperature rating make it straightforward to integrate into standard electronic product designs where reprogrammability and system integration are priorities.

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