XC5VLX110-1FFG676I4165

IC FPGA 440 I/O 676FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 4718592 110592 676-BBGA, FCBGA

Quantity 716 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O440Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8640Number of Logic Elements/Cells110592
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits4718592

Overview of XC5VLX110-1FFG676I4165 – Virtex®-5 LX FPGA, 676-FCBGA, Industrial

The XC5VLX110-1FFG676I4165 is a Virtex®-5 LX field programmable gate array (FPGA) offered in a 676-ball FCBGA package. Built on the Virtex-5 family architecture, this device provides a column-based ASMBL™ fabric and platform features targeted at high-performance logic, DSP, and embedded-system applications.

With 110,592 logic elements, approximately 4.72 Mbits of embedded memory and extensive I/O capability, the device is positioned to deliver high integration and performance for demanding designs that require significant programmable logic, memory, and interface flexibility.

Key Features

  • Programmable Fabric — The device offers 110,592 logic elements and 8,640 CLBs, providing substantial capacity for complex logic and control implementations.
  • Embedded Memory — Approximately 4.72 Mbits of on-chip RAM, including the Virtex-5 family’s 36-Kbit block RAM architecture for true dual-port memory and FIFO configurations.
  • DSP Capability — Series-level support for advanced DSP slices (DSP48E) with 25×18 multiply capability, enabling high-performance signal processing implementations.
  • I/O and SelectIO Technology — 440 I/O pins with SelectIO features (1.2 to 3.3 V I/O operation and digitally-controlled impedance) to support a wide range of parallel and source-synchronous interfaces.
  • Clocking and System Management — Integrated clock management tiles with Digital Clock Managers (DCMs) and PLLs plus system monitoring functionality for robust clocking and health monitoring.
  • Power and Supply — Core supply range from 950 mV to 1.05 V to support the device core operation specified for this part.
  • Package and Mounting — 676-ball BGA, FCBGA package (676-FCBGA, 27×27) in a surface-mount format suitable for compact, high-density board designs.
  • Temperature and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Flexible Configuration — Series-level support for multiple configuration options including SPI and parallel Flash interfaces and multi-bitstream reconfiguration.

Typical Applications

  • High-Performance Logic — Implement large-scale combinational and sequential logic for control, protocol handling, and custom hardware acceleration using the device’s 110,592 logic elements.
  • DSP and Signal Processing — Leverage embedded memory and DSP48E slices for filtering, transforms, and real-time signal processing tasks in communications and instrumentation systems.
  • Embedded Systems and Prototyping — Use the device’s programmable fabric and configuration options to prototype and deploy advanced embedded system designs requiring flexible logic and memory resources.
  • High-Speed Interface Bridging — 440 I/Os and SelectIO features enable implementation of complex memory interfaces, parallel data paths, and source-synchronous connections.

Unique Advantages

  • Large Logic Capacity: 110,592 logic elements provide the headroom to implement complex state machines, datapaths, and control logic without external ASICs.
  • Substantial On-Chip Memory: Approximately 4.72 Mbits of embedded RAM and 36-Kbit block RAM primitives enable efficient buffering, FIFOs, and local storage for high-throughput designs.
  • Integrated DSP Resources: DSP48E slices with 25×18 multiply capability accelerate fixed-point and signal-processing workloads, reducing reliance on external DSP ICs.
  • Flexible I/O and Termination: 440 I/Os with SelectIO and digitally-controlled impedance simplify board-level interfacing across voltage standards and high-speed parallel links.
  • Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in environments requiring extended temperature operation.
  • Compact, High-Density Package: 676-FCBGA (27×27) surface-mount package balances I/O count and board-area efficiency for space-constrained systems.

Why Choose XC5VLX110-1FFG676I4165?

The XC5VLX110-1FFG676I4165 combines a high-capacity Virtex-5 LX fabric with substantial embedded memory, DSP resources, and extensive I/O to address demanding logic, signal processing, and embedded applications. Its industrial temperature rating and compact 676-FCBGA package make it suitable for designs that require both performance and deployment robustness.

This device is well suited for engineers and teams building complex, high-throughput systems that benefit from integrated memory, DSP acceleration, and flexible I/O — enabling reduced board-level component count and streamlined system architecture while leveraging the Virtex-5 family’s architecture and configuration options.

Request a quote or submit your procurement inquiry to receive pricing and availability for the XC5VLX110-1FFG676I4165. Our team can provide configuration and ordering support tailored to your project requirements.

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