XC5VLX110-2FF1760I

The XC5VLX110-2FF1760I is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1760‑ball FCBGA package. It provides a high-density programmable logic resource set suitable for designs that require large on-chip memory, extensive I/O, and operation across industrial temperature ranges.

With 110,592 logic elements, approximately 4.72 Mbits of embedded memory and up to 800 I/O, this device targets complex, high‑capacity digital implementations where integration and predictable operating conditions are important.

Key Features

• Programmable Logic Capacity — 110,592 logic elements with 8,640 configurable logic blocks (CLBs) to implement large-scale custom digital logic.
• Embedded Memory — Total on-chip RAM of 4,718,592 bits (approximately 4.72 Mbits) for buffering, state storage, and local data processing.
• I/O Density — Up to 800 general-purpose I/O pins to support wide bus interfaces and multiple peripheral connections.
• Package — 1760‑BBGA / 1760‑FCBGA package (supplier device package: 1760‑FCBGA, 42.5×42.5 mm) for high pin count and compact board integration.
• Power Supply — Core voltage range from 950 mV to 1.05 V to match system power domains.
• Mounting & Grade — Surface mount device, industrial grade with an operating temperature range of -40 °C to 100 °C for demanding environments.

Typical Applications

• High‑density digital systems — Implement large-scale custom logic where tens of thousands of logic elements and embedded memory are required.
• High‑I/O interface designs — Systems that require broad external connectivity and parallel interfaces utilizing up to 800 I/O pins.
• Industrial control and automation — Designs operating over -40 °C to 100 °C that benefit from industrial-grade FPGA capability and surface-mount integration.

Unique Advantages

• Large programmable fabric: 110,592 logic elements and 8,640 CLBs provide the capacity to integrate complex custom logic without external gate arrays.
• Substantial on‑chip memory: Approximately 4.72 Mbits of embedded RAM reduces external memory dependency and improves data locality.
• Extensive I/O support: Up to 800 I/O pins enable broad connectivity to sensors, peripherals, and parallel interfaces.
• Industrial temperature range: Rated from -40 °C to 100 °C for reliable operation in temperature‑challenging environments.
• Compact high‑pin package: 1760‑FCBGA (42.5×42.5 mm) offers high interconnect density while supporting surface-mount PCB assembly.
• Controlled core voltage: 950 mV–1.05 V core supply range aligns with modern FPGA power architectures.

Why Choose XC5VLX110-2FF1760I?

The XC5VLX110-2FF1760I combines significant logic capacity, substantial embedded memory and a high I/O count in an industrial‑grade FCBGA package, making it well suited for engineers building large, integrated digital systems that must operate reliably across wide temperature ranges. Its specification set supports designs that prioritize on‑chip integration and predictable electrical/thermal behavior.

This device is a practical choice for development teams and OEMs that need scalable programmable logic resources, compact high‑pin packaging, and industrial temperature capability—delivering integration and robustness where board space and operating conditions are key considerations.

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