XC5VLX110-2FFG1153I
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 4718592 110592 1153-BBGA, FCBGA |
|---|---|
| Quantity | 98 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1153-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1153-BBGA, FCBGA | Number of I/O | 800 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8640 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4718592 |
Overview of XC5VLX110-2FFG1153I – Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 4718592 110592 1153-BBGA, FCBGA
The XC5VLX110-2FFG1153I is a Virtex®-5 LX field programmable gate array from AMD, offering a high-density programmable fabric for complex digital designs. It integrates 110,592 logic elements and approximately 4.7 Mbits of embedded memory, combined with up to 800 I/O pins and an industrial operating temperature range.
This device targets applications that require significant on-chip logic, memory and I/O capacity while maintaining industrial-grade temperature tolerance and surface-mount packaging for compact system integration.
Key Features
- Core Logic 110,592 logic elements provide substantial capacity for implementing complex state machines, parallel datapaths and custom hardware accelerators.
- Embedded Memory Approximately 4.7 Mbits of on-chip RAM for buffering, FIFOs and local storage to support high-throughput data processing.
- I/O Density Up to 800 general-purpose I/O pins to connect multiple high-pin-count peripherals, interfaces and I/O banks.
- Package 1153-FCBGA package (35 × 35 mm) in a 1153-BBGA footprint designed for surface-mount assembly and dense board layouts.
- Power Core voltage supply range from 0.95 V to 1.05 V to match system power-domain requirements.
- Industrial Grade & Temperature Range Rated for industrial use with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
- Mounting Surface mount package suitable for automated PCB assembly processes.
- Environmental Compliance RoHS compliant.
Typical Applications
- High-performance signal processing Large logic capacity and on-chip RAM provide the resources needed for FPGA-based DSP blocks, filtering and real-time data manipulation.
- Data acquisition and interfaces High I/O count enables integration with multiple ADC/DAC channels, serial links and parallel capture buses.
- Prototyping and custom hardware acceleration Programmable fabric supports development of custom accelerators and hardware prototypes that require substantial logic and memory.
Unique Advantages
- Substantial on-chip logic: 110,592 logic elements let designers implement complex, high-parallelism functions without external logic expansion.
- Significant embedded memory: Approximately 4.7 Mbits of RAM reduces dependency on external memory for buffering and intermediate storage.
- High I/O connectivity: 800 I/Os support dense peripheral integration and flexible interface routing on a single device.
- Industrial temperature tolerance: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
- Surface-mount FCBGA packaging: 1153-FCBGA (35 × 35 mm) enables compact PCB designs and automated assembly.
- RoHS compliant: Meets environmental compliance requirements for lead-free manufacturing.
Why Choose XC5VLX110-2FFG1153I?
The XC5VLX110-2FFG1153I positions itself as a high-density Virtex-5 LX FPGA option for designs that demand large logic capacity, substantial on-chip memory and extensive I/O in an industrial-grade, surface-mount package. Its combination of 110,592 logic elements, approximately 4.7 Mbits of embedded RAM and 800 I/Os provides a balanced platform for compute- and data-intensive FPGA designs.
This device is suited to engineering teams building custom hardware accelerators, high-throughput data systems, or multi-interface platforms that require a reliable component rated for −40 °C to 100 °C operation and RoHS compliance.
Request a quote or submit an inquiry to get pricing and availability for the XC5VLX110-2FFG1153I and discuss how it fits your project requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








