XC5VLX110-2FF676C
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 4718592 110592 676-BBGA, FCBGA |
|---|---|
| Quantity | 366 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 440 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8640 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4718592 |
Overview of XC5VLX110-2FF676C – Virtex®-5 LX FPGA, 110,592 logic elements
The XC5VLX110-2FF676C is a Virtex‑5 LX field programmable gate array (FPGA) from AMD. It integrates 110,592 logic elements across 8,640 configurable logic blocks (CLBs) and provides approximately 4.5 Mbits of on‑chip embedded memory.
Designed for surface-mount applications, this device offers 440 user I/O pins in a 676‑ball FCBGA package, operates from 0 °C to 85 °C, and uses a core supply range of 0.95 V to 1.05 V.
Key Features
- Core and Logic 8,640 configurable logic blocks delivering a total of 110,592 logic elements for implementing custom digital logic and control functions.
- Embedded Memory Approximately 4.5 Mbits of on‑chip RAM to support buffering, look‑up tables, and state storage without external memory.
- I/O Capacity 440 user I/O pins to enable broad external connectivity and interfacing with peripherals and system components.
- Power Core voltage supply specified between 0.95 V and 1.05 V to match system power rails and enable predictable power budgeting.
- Package & Mounting 676‑ball FCBGA (27×27) package in a surface‑mount form factor suitable for PCB assembly processes.
- Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Compliance RoHS‑compliant construction for environmental compliance in applicable markets.
Unique Advantages
- Large logic capacity: 110,592 logic elements enable implementation of substantial custom logic and complex designs on a single device.
- Integrated on‑chip memory: Approximately 4.5 Mbits of embedded RAM reduces the need for external memory in many designs.
- High I/O count: 440 I/O pins provide flexibility for multi‑interface systems and high‑pin‑count peripheral connections.
- Compact surface‑mount package: 676‑ball FCBGA (27×27) offers dense routing and compact board footprint for space‑constrained designs.
- predictable supply requirements: Narrow core voltage range (0.95 V–1.05 V) aids in power supply selection and design consistency.
- RoHS compliant: Environmentally compliant assembly for markets requiring lead‑free components.
Why Choose XC5VLX110-2FF676C?
The XC5VLX110-2FF676C positions itself as a high‑capacity Virtex‑5 LX FPGA option from AMD, combining a large logic element count, substantial embedded memory, and a high I/O count in a 676‑ball FCBGA surface‑mount package. Its electrical and thermal specifications—0.95 V to 1.05 V core supply and 0 °C to 85 °C operating range—provide predictable behavior for commercial applications.
This device is suitable for design teams needing significant on‑chip logic and memory integration with broad I/O capability while maintaining a compact, surface‑mount footprint and RoHS compliance.
Request a quote or submit an inquiry to receive pricing and availability for the XC5VLX110-2FF676C.
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
