XC5VLX110-2FFG1153C

The XC5VLX110-2FFG1153C is a Virtex‑5 LX Field Programmable Gate Array (FPGA) from AMD, delivering a high on‑chip logic capacity and substantial embedded memory in a 1153‑FBGA package. It is designed for designs that require large logic density, significant embedded RAM, and a high density of I/O in a surface‑mount FCBGA form factor.

With 110,592 logic elements and approximately 4.72 Mbits of embedded memory, this commercial‑grade device addresses applications that need integration of complex logic functions while operating within a 0 °C to 85 °C range and a core voltage of 0.95 V to 1.05 V.

Key Features

• Core Logic 110,592 logic elements provide high digital integration capability for complex logic implementations.
• Configurable Logic Blocks Logic resources sized to support large‑scale programmable logic designs.
• Embedded Memory Approximately 4.72 Mbits of on‑chip RAM to support buffering, lookup tables, and distributed memory functions.
• I/O Capacity Up to 800 I/O pins to support broad interfacing needs and high pin‑count system designs.
• Power and Voltage Core supply operating range from 950 mV to 1.05 V to match system power architectures.
• Package and Mounting 1153‑FCBGA (supplier device package: 1153‑FCBGA, 35×35) in a surface‑mount package for compact board integration.
• Operating Range Commercial grade operation specified from 0 °C to 85 °C.
• Compliance RoHS compliant for environmental compatibility.

Typical Applications

• High‑density digital designs — Use the device where a large number of logic elements and embedded memory are required to implement complex custom logic.
• High‑I/O systems — Suited for designs that need up to 800 external I/O connections for wide‑bandwidth interfacing and board‑level integration.
• Memory‑intensive functions — Embedded RAM capacity supports buffering, lookup operations, and on‑chip data storage for performance‑sensitive tasks.

Unique Advantages

• High logic density: 110,592 logic elements enable consolidation of multiple functions into a single FPGA, reducing board complexity.
• Significant on‑chip memory: Approximately 4.72 Mbits of embedded RAM supports data buffering and local storage without external memory.
• Extensive I/O count: 800 I/Os allow flexible connectivity and reduce the need for additional interface components.
• Compact packaged solution: 1153‑FCBGA (35×35) surface‑mount package provides a compact footprint for space‑constrained systems.
• Commercial temperature operation: Specified 0 °C to 85 °C operation aligns with a wide range of commercial electronics environments.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and supply chains.

Why Choose XC5VLX110-2FFG1153C?

The XC5VLX110-2FFG1153C brings together large logic capacity, meaningful embedded memory, and a high I/O count in a compact 1153‑FCBGA package, making it suitable for designs that demand integrated, high‑density programmable logic. Its commercial‑grade operating range and RoHS compliance make it appropriate for a broad set of electronic products and systems that operate within 0 °C to 85 °C.

This part is well suited for engineers and procurement teams looking to consolidate board‑level functionality into a single FPGA, minimize external components, and scale designs that require substantial on‑chip resources while conforming to standard commercial operating conditions.

Request a quote or submit a pricing inquiry to evaluate the XC5VLX110-2FFG1153C for your next design project.