XC5VLX110-2FFG676I

The XC5VLX110-2FFG676I is a Virtex®-5 LX field programmable gate array (FPGA) in a 676-ball FCBGA package. It provides high-density programmable logic with 110,592 logic elements and approximately 4.72 Mbits of embedded memory, along with up to 440 general-purpose I/O pins.

Designed and specified for industrial-grade operation, the device supports a supply range of 950 mV to 1.05 V, a surface-mount 676-FCBGA (27×27) package, and an operating temperature range of −40 °C to 100 °C. It is RoHS compliant.

Key Features

• Core Logic — 110,592 logic elements (cells) provide high-density programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 4.72 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Capacity — Up to 440 I/O pins to support wide interfacing and complex board-level connectivity.
• Power — Core voltage specified from 950 mV to 1.05 V to match system power-rail requirements.
• Package and Mounting — 676-ball FCBGA (27×27) surface-mount package for compact, board-level integration; package case listed as 676-BBGA, FCBGA.
• Operating Range — Industrial-grade temperature rating from −40 °C to 100 °C for deployment in thermally demanding environments.
• Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control — Industrial-grade temperature rating and high I/O count suit control and automation systems that require robust operation and broad connectivity.
• High-Density Logic Designs — Large logic element count and embedded memory support complex programmable logic implementations and system integration on a single device.
• Embedded Interfaces — Extensive I/O and on-chip RAM enable implementation of multiple interfaces and local data buffering in compact board layouts.

Unique Advantages

• Highly integrated logic capacity: 110,592 logic elements enable consolidation of multiple functions into a single FPGA, reducing bill-of-materials and board complexity.
• Substantial on-chip memory: Approximately 4.72 Mbits of embedded RAM supports data buffering and intermediate storage without external memory.
• Extensive I/O resources: 440 I/O pins provide flexible connectivity options for multi-interface designs and dense system interconnects.
• Industrial temperature range: Specified operation from −40 °C to 100 °C for applications requiring reliable performance across wide ambient conditions.
• Compact FCBGA packaging: 676-FCBGA (27×27) surface-mount package enables high-density board placement and mechanical stability for production assemblies.
• Regulatory compliance: RoHS compliance supports environmentally conscious product designs and regulatory requirements.

Why Choose XC5VLX110-2FFG676I?

The XC5VLX110-2FFG676I positions itself as a high-density, industrial-grade FPGA option for designers who require significant programmable logic, embedded memory, and broad I/O capability in a compact FCBGA package. Its combination of 110,592 logic elements, approximately 4.72 Mbits of on-chip RAM, and 440 I/O pins supports consolidation of complex system functions into a single device.

With a specified core supply range of 950 mV to 1.05 V, surface-mount 676-FCBGA packaging, and an operating temperature span of −40 °C to 100 °C, this device is suited to durable, space-efficient designs where robust operation and long-term deployment are priorities.

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