XC5VLX110-3FFG676C

The XC5VLX110-3FFG676C is a Virtex®-5 LX field programmable gate array (FPGA) by AMD, designed for high-density programmable logic implementations. It provides a large logic fabric and substantial on-chip memory in a 676-FCBGA (27×27) surface-mount package for commercial-grade electronic designs.

With 110,592 logic elements, approximately 4.72 Mbits of embedded memory, and 440 I/O, this device targets designs that require significant logic capacity, embedded storage, and extensive external interfacing while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity  110,592 logic elements to implement complex digital functions and large custom logic blocks.
• Embedded Memory  Approximately 4.72 Mbits of on-chip RAM for local data buffering, state storage, and algorithmic working memory.
• I/O Density  440 user I/O pins to support multiple external interfaces and parallel connectivity.
• Package  676-BBGA / FCBGA package with supplier device package specified as 676-FCBGA (27×27), optimized for surface-mount PCB assembly.
• Power  Core voltage supply range of 950 mV to 1.05 V to match system power-rail requirements.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Mounting & Compliance  Surface-mount device, RoHS compliant for regulatory and assembly compatibility.

Typical Applications

• High-density digital processing  Use the large logic capacity and embedded RAM to implement custom datapaths, accelerators, and complex state machines.
• I/O-intensive interface bridging  Leverage 440 I/O pins to connect multiple peripherals, parallel busses, and external devices on board-level designs.
• Board-level system integration  The 676-FCBGA (27×27) surface-mount package simplifies placement in compact PCBs where a high-capacity FPGA is required.

Unique Advantages

• Large programmable fabric: 110,592 logic elements provide the headroom for complex, scalable logic designs without immediate need for partitioning across multiple devices.
• Substantial on-chip memory: Approximately 4.72 Mbits of embedded RAM enables local buffering and reduces dependence on off-chip memory for many workloads.
• Extensive external connectivity: 440 I/O pins allow flexible interfacing and support for multiple simultaneous external connections, simplifying system architecture.
• Standard commercial profile: 0 °C to 85 °C operating range and commercial grade make the device suitable for general-purpose electronics and many embedded applications.
• Surface-mount, RoHS-compliant package: 676-FCBGA (27×27) surface-mount packaging supports automated assembly and meets common environmental compliance requirements.

Why Choose XC5VLX110-3FFG676C?

The XC5VLX110-3FFG676C positions itself as a high-density Virtex-5 LX FPGA option for designs that demand significant programmable logic, embedded memory, and broad external connectivity in a single, surface-mount package. Its combination of 110,592 logic elements, approximately 4.72 Mbits of on-chip RAM, and 440 I/O supports complex implementations while remaining within a commercial-grade operating envelope.

This device is well suited for engineering teams and procurement groups seeking a scalable FPGA platform from AMD for board-level integration where large logic resource counts, on-chip memory, and I/O flexibility matter. The RoHS-compliant 676-FCBGA package and standard supply/temperature specifications help streamline design, assembly, and lifecycle considerations.

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