XC5VLX110-2FFV1153C
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 4718592 110592 1153-BBGA, FCBGA |
|---|---|
| Quantity | 929 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1153-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1153-BBGA, FCBGA | Number of I/O | 800 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8640 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4718592 |
Overview of XC5VLX110-2FFV1153C – Virtex®-5 LX Field Programmable Gate Array (FPGA)
The XC5VLX110-2FFV1153C is a Virtex-5 LX series field programmable gate array provided in a 1153-FCBGA (35×35) surface-mount package. It delivers substantial on-chip resources—110,592 logic elements and approximately 4.72 Mbits of embedded memory—combined with up to 800 I/O pins, making it suitable for designs that require high logic capacity and dense I/O integration.
Supplied as a commercial-grade device, the FPGA operates from a core supply of 0.95 V to 1.05 V and is rated for operation from 0 °C to 85 °C. The part is RoHS compliant and packaged in a 1153-BBGA/FCBGA footprint for board-level integration.
Key Features
- Core Logic Capacity — 110,592 logic elements for implementing large-scale programmable logic and custom digital functions.
- Embedded Memory — Approximately 4.72 Mbits (4,718,592 bits) of on-chip RAM for buffering, state storage, and data processing tasks.
- I/O Density — Up to 800 I/O pins to support complex system interfacing and connectivity requirements.
- Power — Core voltage supply range from 0.95 V to 1.05 V to match board-level power architectures.
- Package & Mounting — 1153-FCBGA (35×35) supplier device package in a 1153-BBGA/FCBGA form factor, surface mount for compact PCB implementation.
- Temperature & Grade — Commercial grade device rated for operation from 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Custom digital logic — Implement complex, application-specific logic where high logic element counts and on-chip RAM enable compact, programmable solutions.
- High-density I/O systems — Use the 800 I/O pins to interface multiple peripherals, sensors, or high-bandwidth data lanes on a single device.
- System prototyping and integration — Leverage the large logic and memory resources in a single FCBGA package for board-level prototypes and integrated subsystems.
Unique Advantages
- Substantial programmable capacity: 110,592 logic elements accommodate large logic designs without immediate partitioning across multiple devices.
- Significant on-chip RAM: Approximately 4.72 Mbits of embedded memory reduces external memory dependency and simplifies data buffering and state storage.
- High I/O count: Up to 800 I/Os provide flexible connectivity for multi-channel systems and dense peripheral integration.
- Compact, board-ready package: The 1153-FCBGA (35×35) surface-mount package supports compact PCB layouts and simplified assembly.
- Commercial temperature rating: Rated 0 °C to 85 °C for typical commercial electronic applications.
- RoHS compliant: Meets environmental compliance requirements for lead-free assembly processes.
Why Choose XC5VLX110-2FFV1153C?
The XC5VLX110-2FFV1153C positions itself as a high-capacity Virtex-5 LX FPGA option for designs needing large programmable logic resources, ample embedded memory, and extensive I/O in a compact FCBGA package. Its combination of 110,592 logic elements, approximately 4.72 Mbits of on-chip RAM, and up to 800 I/Os makes it suitable for developers pursuing dense, integrated FPGA-based solutions within commercial temperature ranges.
For projects where logic density, on-chip memory, and interface count drive board-level architecture, this device provides a concentrated set of resources that can reduce external component count and streamline system integration while maintaining RoHS compliance.
Request a quote or submit an inquiry to receive pricing and availability information for the XC5VLX110-2FFV1153C.

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