XC5VLX110-2FFG1760C

IC FPGA 800 I/O 1760FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 4718592 110592 1760-BBGA, FCBGA

Quantity 1,057 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O800Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8640Number of Logic Elements/Cells110592
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4718592

Overview of XC5VLX110-2FFG1760C – Virtex®-5 LX Field Programmable Gate Array (FPGA) IC

The XC5VLX110-2FFG1760C is a Virtex-5 LX family Field Programmable Gate Array (FPGA) offered in a high-pin-count FCBGA package. It delivers a substantial logic fabric, embedded memory, and a large I/O count in a surface-mount format suitable for commercial-grade systems.

With 110,592 logic elements, approximately 4.72 Mbits of on-chip RAM and 800 I/O pins, this device targets applications that require dense programmable logic, significant local memory, and extensive external interfacing while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

  • Core logic — 110,592 logic elements provide extensive programmable fabric for implementing complex digital functions and custom logic.
  • Embedded memory — Approximately 4.72 Mbits of on-chip RAM to support buffering, packet storage, and stateful logic without immediate reliance on external memory.
  • I/O capacity — 800 user I/O pins for high-density external interfacing and multi-channel connectivity.
  • Power — Core voltage supply specified from 0.95 V to 1.05 V for system power planning and regulator selection.
  • Package — 1760-FCBGA (1760-BBGA, 42.5 × 42.5 mm) surface-mount package optimized for high-pin-count board designs.
  • Operating conditions — Commercial grade device rated for 0 °C to 85 °C operation.
  • Environmental compliance — RoHS compliant.

Typical Applications

  • High-density I/O systems — Leverages up to 800 I/Os for designs requiring extensive external interfaces or parallel connectivity.
  • Complex digital processing — Uses a large logic element count and on-chip RAM for implementing custom datapaths, protocol processing, and glue logic.
  • System prototyping and integration — Commercial-grade FPGA suitable for consolidating multiple functions into a single programmable device during development and early production.

Unique Advantages

  • Large programmable capacity: 110,592 logic elements enable integration of complex functions and reduce the need for multiple discrete devices.
  • Significant on-chip RAM: Approximately 4.72 Mbits of embedded memory lowers external memory dependency and improves data-path locality.
  • Extensive external connectivity: 800 I/O pins simplify board-level wiring for multi-channel or multi-interface systems.
  • Compact, high-pin-count package: 1760-FCBGA (42.5 × 42.5 mm) supports dense routing and saves board area compared to multiple smaller devices.
  • Commercial operating range: Rated 0 °C to 85 °C for deployments in standard commercial environments.
  • Regulatory compatibility: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XC5VLX110-2FFG1760C?

The XC5VLX110-2FFG1760C positions itself as a high-capacity, commercially rated FPGA choice for engineers who need extensive programmable logic, substantial embedded memory, and a very high I/O count in a single surface-mount package. Its 1760-FCBGA form factor and defined core voltage range support compact, power-aware board designs.

This device is well suited for designs that consolidate multiple digital functions, require significant on-chip RAM, or demand broad external connectivity while operating within commercial temperature limits. Its combination of logic, memory, and I/O provides a scalable building block for complex system-level implementations.

Request a quote or submit an inquiry to receive pricing and availability information for the XC5VLX110-2FFG1760C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up