XC5VLX110-2FFG1760C
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 4718592 110592 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,057 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 800 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8640 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4718592 |
Overview of XC5VLX110-2FFG1760C – Virtex®-5 LX Field Programmable Gate Array (FPGA) IC
The XC5VLX110-2FFG1760C is a Virtex-5 LX family Field Programmable Gate Array (FPGA) offered in a high-pin-count FCBGA package. It delivers a substantial logic fabric, embedded memory, and a large I/O count in a surface-mount format suitable for commercial-grade systems.
With 110,592 logic elements, approximately 4.72 Mbits of on-chip RAM and 800 I/O pins, this device targets applications that require dense programmable logic, significant local memory, and extensive external interfacing while operating within a 0 °C to 85 °C commercial temperature range.
Key Features
- Core logic — 110,592 logic elements provide extensive programmable fabric for implementing complex digital functions and custom logic.
- Embedded memory — Approximately 4.72 Mbits of on-chip RAM to support buffering, packet storage, and stateful logic without immediate reliance on external memory.
- I/O capacity — 800 user I/O pins for high-density external interfacing and multi-channel connectivity.
- Power — Core voltage supply specified from 0.95 V to 1.05 V for system power planning and regulator selection.
- Package — 1760-FCBGA (1760-BBGA, 42.5 × 42.5 mm) surface-mount package optimized for high-pin-count board designs.
- Operating conditions — Commercial grade device rated for 0 °C to 85 °C operation.
- Environmental compliance — RoHS compliant.
Typical Applications
- High-density I/O systems — Leverages up to 800 I/Os for designs requiring extensive external interfaces or parallel connectivity.
- Complex digital processing — Uses a large logic element count and on-chip RAM for implementing custom datapaths, protocol processing, and glue logic.
- System prototyping and integration — Commercial-grade FPGA suitable for consolidating multiple functions into a single programmable device during development and early production.
Unique Advantages
- Large programmable capacity: 110,592 logic elements enable integration of complex functions and reduce the need for multiple discrete devices.
- Significant on-chip RAM: Approximately 4.72 Mbits of embedded memory lowers external memory dependency and improves data-path locality.
- Extensive external connectivity: 800 I/O pins simplify board-level wiring for multi-channel or multi-interface systems.
- Compact, high-pin-count package: 1760-FCBGA (42.5 × 42.5 mm) supports dense routing and saves board area compared to multiple smaller devices.
- Commercial operating range: Rated 0 °C to 85 °C for deployments in standard commercial environments.
- Regulatory compatibility: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose XC5VLX110-2FFG1760C?
The XC5VLX110-2FFG1760C positions itself as a high-capacity, commercially rated FPGA choice for engineers who need extensive programmable logic, substantial embedded memory, and a very high I/O count in a single surface-mount package. Its 1760-FCBGA form factor and defined core voltage range support compact, power-aware board designs.
This device is well suited for designs that consolidate multiple digital functions, require significant on-chip RAM, or demand broad external connectivity while operating within commercial temperature limits. Its combination of logic, memory, and I/O provides a scalable building block for complex system-level implementations.
Request a quote or submit an inquiry to receive pricing and availability information for the XC5VLX110-2FFG1760C.

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