XC5VLX110-2FFV1153I

IC FPGA 800 I/O 1153FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 4718592 110592 1153-BBGA, FCBGA

Quantity 4 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1153-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1153-BBGA, FCBGANumber of I/O800Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8640Number of Logic Elements/Cells110592
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4718592

Overview of XC5VLX110-2FFV1153I – Virtex®-5 LX FPGA, 110,592 Logic Elements, 1153-FCBGA

The XC5VLX110-2FFV1153I is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD. It delivers a high-density programmable fabric with 110,592 logic elements and approximately 4.72 Mbits of embedded memory in a 1153-ball FCBGA package.

Engineered for industrial operating conditions, this device provides up to 800 I/O lines and operates across a core supply range of 950 mV to 1.05 V, supporting designs that require substantial logic capacity and dense I/O in a surface-mount FCBGA footprint.

Key Features

  • Logic Capacity 110,592 logic elements provide significant programmable resources for complex digital designs.
  • Embedded Memory Approximately 4.72 Mbits of on-chip RAM for buffering, FIFOs, and state storage within the FPGA fabric.
  • High I/O Count Up to 800 I/Os to support large numbers of external interfaces and parallel connectivity.
  • Power Supply Range Core voltage supported from 950 mV to 1.05 V to match system power rails and design requirements.
  • Package and Mounting 1153-ball FCBGA (1153-BBGA) surface-mount package with a 35 × 35 mm supplier device footprint for compact high-density board designs.
  • Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Manufacturer Supplied by AMD, following the Virtex®-5 LX product family naming and packaging conventions.

Unique Advantages

  • High integration density: 110,592 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
  • Ample on-chip memory: Approximately 4.72 Mbits of embedded RAM supports sizable data buffering and local storage without external memory.
  • Extensive I/O connectivity: 800 I/Os enable broad interfacing options for parallel peripherals, sensors, and external controllers.
  • Industrial-grade operation: −40 °C to 100 °C rating provides reliable operation across a wide temperature range.
  • Compact, surface-mount FCBGA: 1153-ball package in a 35 × 35 mm footprint provides a balance of density and board-level integration.
  • Controlled core voltage window: 0.95 V to 1.05 V supply range facilitates predictable power design and margining.

Why Choose XC5VLX110-2FFV1153I?

The XC5VLX110-2FFV1153I combines high logic capacity, substantial embedded memory, and a large I/O count in a single industrial-grade FCBGA package. This configuration is suited for designs that require dense programmable logic and extensive external connectivity while maintaining defined thermal and power envelopes.

As a Virtex®-5 LX device from AMD, it provides a clear specification set—logic elements, on-chip RAM, I/O count, package, voltage range, and operating temperature—that helps engineering and procurement teams assess fit for mid- to high-density FPGA applications where integration and reliability matter.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for XC5VLX110-2FFV1153I.

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