XC5VLX110-2FFV1153I
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 4718592 110592 1153-BBGA, FCBGA |
|---|---|
| Quantity | 4 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1153-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1153-BBGA, FCBGA | Number of I/O | 800 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8640 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4718592 |
Overview of XC5VLX110-2FFV1153I – Virtex®-5 LX FPGA, 110,592 Logic Elements, 1153-FCBGA
The XC5VLX110-2FFV1153I is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD. It delivers a high-density programmable fabric with 110,592 logic elements and approximately 4.72 Mbits of embedded memory in a 1153-ball FCBGA package.
Engineered for industrial operating conditions, this device provides up to 800 I/O lines and operates across a core supply range of 950 mV to 1.05 V, supporting designs that require substantial logic capacity and dense I/O in a surface-mount FCBGA footprint.
Key Features
- Logic Capacity 110,592 logic elements provide significant programmable resources for complex digital designs.
- Embedded Memory Approximately 4.72 Mbits of on-chip RAM for buffering, FIFOs, and state storage within the FPGA fabric.
- High I/O Count Up to 800 I/Os to support large numbers of external interfaces and parallel connectivity.
- Power Supply Range Core voltage supported from 950 mV to 1.05 V to match system power rails and design requirements.
- Package and Mounting 1153-ball FCBGA (1153-BBGA) surface-mount package with a 35 × 35 mm supplier device footprint for compact high-density board designs.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Manufacturer Supplied by AMD, following the Virtex®-5 LX product family naming and packaging conventions.
Unique Advantages
- High integration density: 110,592 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
- Ample on-chip memory: Approximately 4.72 Mbits of embedded RAM supports sizable data buffering and local storage without external memory.
- Extensive I/O connectivity: 800 I/Os enable broad interfacing options for parallel peripherals, sensors, and external controllers.
- Industrial-grade operation: −40 °C to 100 °C rating provides reliable operation across a wide temperature range.
- Compact, surface-mount FCBGA: 1153-ball package in a 35 × 35 mm footprint provides a balance of density and board-level integration.
- Controlled core voltage window: 0.95 V to 1.05 V supply range facilitates predictable power design and margining.
Why Choose XC5VLX110-2FFV1153I?
The XC5VLX110-2FFV1153I combines high logic capacity, substantial embedded memory, and a large I/O count in a single industrial-grade FCBGA package. This configuration is suited for designs that require dense programmable logic and extensive external connectivity while maintaining defined thermal and power envelopes.
As a Virtex®-5 LX device from AMD, it provides a clear specification set—logic elements, on-chip RAM, I/O count, package, voltage range, and operating temperature—that helps engineering and procurement teams assess fit for mid- to high-density FPGA applications where integration and reliability matter.
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