XC5VLX110-3FFG1153C

The XC5VLX110-3FFG1153C is a Virtex®-5 LX field programmable gate array (FPGA) IC from AMD supplied in a 1153-ball FCBGA package. It delivers high logic capacity and substantial embedded memory for designs that require dense programmable logic, on-chip RAM, and a large number of I/O.

With 110,592 logic elements and approximately 4.7 Mbits of embedded memory, this commercial-grade, surface-mount FPGA targets applications that need significant logic integration while operating within a 0 °C to 85 °C range and a core supply window of 0.95 V to 1.05 V.

Key Features

• Core Logic 110,592 logic elements provide a high-density fabric for implementing complex custom digital designs and parallel processing blocks.
• Embedded Memory Approximately 4.7 Mbits of on-chip RAM to support data buffering, state storage, and memory-hungry logic functions without external memory for many use cases.
• I/O Capacity Up to 800 I/O pins to support extensive interfacing and multi-channel connectivity in I/O-rich designs.
• Package and Mounting 1153-BBGA / 1153-FCBGA (35×35) package in a surface-mount form factor for dense board-level integration.
• Power Core supply range of 0.95 V to 1.05 V to match system power rails and enable stable core operation within the specified window.
• Operating Range Commercial temperature grade: 0 °C to 85 °C for standard commercial deployments.
• RoHS Compliance Environmentally compliant with RoHS requirements for lead-free assembly.

Typical Applications

• Custom digital logic and algorithm implementation Use the 110,592 logic elements and on-chip memory to implement complex, application-specific processing and control logic.
• High I/O interface hubs Up to 800 I/O enable dense interfacing and protocol bridging between multiple subsystems.
• Memory-backed state machines and buffering Approximately 4.7 Mbits of embedded RAM support local buffering and state storage for streaming or packetized data flows.

Unique Advantages

• High logic density: 110,592 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 4.7 Mbits of embedded RAM minimizes reliance on external memory for many designs, simplifying BOM and layout.
• Extensive I/O: 800 I/O pins provide flexibility for multi-channel interfaces, sensor arrays, and complex peripheral connectivity.
• Compact package: 1153-FCBGA (35×35) package supports high-density PCB designs while maintaining a surface-mount assembly flow.
• Commercial-grade operation: Rated for 0 °C to 85 °C to meet standard commercial deployment environments.
• RoHS compliant: Meets environmental requirements for lead-free manufacturing.

Why Choose XC5VLX110-3FFG1153C?

The XC5VLX110-3FFG1153C positions itself as a high-capacity, commercially graded FPGA suitable for designs that require large programmable logic resources, significant on-chip RAM, and a high pin count for complex I/O. Its combination of 110,592 logic elements, approximately 4.7 Mbits of embedded memory, and up to 800 I/O makes it a strong candidate for consolidating multiple digital functions into a single device.

This device benefits teams seeking a scalable, integrated solution for mid- to high-density FPGA implementations, offering straightforward surface-mount package integration, a defined core voltage range, and RoHS compliance for modern manufacturing requirements.

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