XC5VLX110-2FF676I
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 4718592 110592 676-BBGA, FCBGA |
|---|---|
| Quantity | 1,253 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 440 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8640 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4718592 |
Overview of XC5VLX110-2FF676I – Virtex®-5 LX FPGA, 110,592 Logic Elements, 676-FCBGA
The XC5VLX110-2FF676I is a Virtex®-5 LX field programmable gate array (FPGA) offered in a 676-ball FCBGA package. It delivers a high-density programmable fabric with a large number of I/O and embedded memory for complex digital designs.
Designed for industrial applications, this device combines significant logic capacity, substantial on-chip RAM, and a wide operating temperature range to support demanding embedded and system-level implementations.
Key Features
- Core Logic 110,592 logic elements provide substantial programmable resources for implementing complex digital functions and custom accelerators.
- Configurable Logic Blocks 8,640 CLBs (configurable logic blocks) for structured logic partitioning and efficient mapping of designs.
- Embedded Memory Approximately 4.72 Mbits of on-chip RAM to support data buffering, FIFOs, and state storage without external memory for many use cases.
- I/O Capacity 440 user I/O pins to connect to high-pin-count interfaces, sensors, and external peripherals.
- Power Supply Core voltage supply range of 0.95 V to 1.05 V for defined power and timing characteristics.
- Package and Mounting 676-ball FCBGA package (676-FCBGA, 27×27) with surface-mount construction for board-level integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
- RoHS Compliant Compliant with RoHS standards for lead-free manufacturing and reduced environmental impact.
Typical Applications
- Industrial Control & Automation Implement motor control logic, PLC functions, and deterministic I/O handling using the device’s industrial temperature rating and large I/O count.
- High‑Density Logic Integration Consolidate multiple digital functions or hardware accelerators into a single FPGA leveraging 110,592 logic elements and abundant embedded RAM.
- Interface Bridging and Protocol Conversion Use the 440 I/Os to bridge between disparate buses and implement protocol converters without extensive external glue logic.
- Embedded System Prototyping Rapidly prototype system-level designs that require significant programmable logic and on-chip memory for buffering and state machines.
Unique Advantages
- High Logic Density: 110,592 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
- Substantial On‑Chip Memory: Approximately 4.72 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
- Generous I/O Count: 440 I/Os simplify connectivity to sensors, actuators, and external interfaces, reducing the need for additional interface components.
- Industrial Reliability: −40 °C to 100 °C operating range supports deployment in industrial environments with wider temperature demands.
- Standard FCBGA Packaging: 676-ball FCBGA (27×27) provides a compact, surface-mount solution suitable for high-density PCB designs.
- Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.
Why Choose XC5VLX110-2FF676I?
The XC5VLX110-2FF676I positions itself as a high-capacity, industrial-grade FPGA option that combines extensive programmable logic, significant embedded memory, and a high I/O count in a compact FCBGA package. Its electrical and thermal specifications make it suitable for industrial and embedded system designs that require robust, on-board programmable resources.
This device is well suited for engineers and development teams looking to consolidate complex logic, implement protocol bridging, or prototype system-level functions with a single, RoHS-compliant FPGA offering.
Request a quote or submit an inquiry to receive pricing and availability for the XC5VLX110-2FF676I and to discuss how it can meet your project requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








