XC5VLX110-2FF676I

IC FPGA 440 I/O 676FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 4718592 110592 676-BBGA, FCBGA

Quantity 1,253 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O440Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8640Number of Logic Elements/Cells110592
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4718592

Overview of XC5VLX110-2FF676I – Virtex®-5 LX FPGA, 110,592 Logic Elements, 676-FCBGA

The XC5VLX110-2FF676I is a Virtex®-5 LX field programmable gate array (FPGA) offered in a 676-ball FCBGA package. It delivers a high-density programmable fabric with a large number of I/O and embedded memory for complex digital designs.

Designed for industrial applications, this device combines significant logic capacity, substantial on-chip RAM, and a wide operating temperature range to support demanding embedded and system-level implementations.

Key Features

  • Core Logic 110,592 logic elements provide substantial programmable resources for implementing complex digital functions and custom accelerators.
  • Configurable Logic Blocks 8,640 CLBs (configurable logic blocks) for structured logic partitioning and efficient mapping of designs.
  • Embedded Memory Approximately 4.72 Mbits of on-chip RAM to support data buffering, FIFOs, and state storage without external memory for many use cases.
  • I/O Capacity 440 user I/O pins to connect to high-pin-count interfaces, sensors, and external peripherals.
  • Power Supply Core voltage supply range of 0.95 V to 1.05 V for defined power and timing characteristics.
  • Package and Mounting 676-ball FCBGA package (676-FCBGA, 27×27) with surface-mount construction for board-level integration.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
  • RoHS Compliant Compliant with RoHS standards for lead-free manufacturing and reduced environmental impact.

Typical Applications

  • Industrial Control & Automation Implement motor control logic, PLC functions, and deterministic I/O handling using the device’s industrial temperature rating and large I/O count.
  • High‑Density Logic Integration Consolidate multiple digital functions or hardware accelerators into a single FPGA leveraging 110,592 logic elements and abundant embedded RAM.
  • Interface Bridging and Protocol Conversion Use the 440 I/Os to bridge between disparate buses and implement protocol converters without extensive external glue logic.
  • Embedded System Prototyping Rapidly prototype system-level designs that require significant programmable logic and on-chip memory for buffering and state machines.

Unique Advantages

  • High Logic Density: 110,592 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
  • Substantial On‑Chip Memory: Approximately 4.72 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • Generous I/O Count: 440 I/Os simplify connectivity to sensors, actuators, and external interfaces, reducing the need for additional interface components.
  • Industrial Reliability: −40 °C to 100 °C operating range supports deployment in industrial environments with wider temperature demands.
  • Standard FCBGA Packaging: 676-ball FCBGA (27×27) provides a compact, surface-mount solution suitable for high-density PCB designs.
  • Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose XC5VLX110-2FF676I?

The XC5VLX110-2FF676I positions itself as a high-capacity, industrial-grade FPGA option that combines extensive programmable logic, significant embedded memory, and a high I/O count in a compact FCBGA package. Its electrical and thermal specifications make it suitable for industrial and embedded system designs that require robust, on-board programmable resources.

This device is well suited for engineers and development teams looking to consolidate complex logic, implement protocol bridging, or prototype system-level functions with a single, RoHS-compliant FPGA offering.

Request a quote or submit an inquiry to receive pricing and availability for the XC5VLX110-2FF676I and to discuss how it can meet your project requirements.

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