XC5VLX110-2FF1760C

The XC5VLX110-2FF1760C is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD. It provides 110,592 logic elements and approximately 4.7 Mbits of embedded RAM to support complex, custom digital logic implementations.

With 800 I/O pins, a 1760-FCBGA package (42.5×42.5 mm), and a commercial temperature rating, this device targets designs that require large programmable logic capacity and substantial external interfacing in a surface-mount BGA form factor.

Key Features

• Logic Capacity  110,592 logic elements for implementing complex custom logic and parallel functions.
• Embedded Memory  Approximately 4.7 Mbits of on-chip RAM to support buffering, lookup tables, and small data storage needs.
• I/O Density  800 user I/O pins to accommodate multiple external interfaces and high pin-count connections.
• Power Supply  Core voltage range of 950 mV to 1.05 V, suitable for the device’s specified operating conditions.
• Package and Mounting  1760-FCBGA (42.5×42.5) package in a 1760-BBGA FCBGA case, designed for surface-mount assembly.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard environmental conditions.
• RoHS Compliance  RoHS compliant construction for regulatory and environmental considerations.

Typical Applications

• I/O-Intensive Systems  Leverage 800 I/O pins for designs that require many external connections or multi-channel interfacing.
• Custom Logic and Prototyping  Use the 110,592 logic elements to implement and validate complex custom logic blocks and prototypes.
• Embedded Memory-Dependent Tasks  Approximately 4.7 Mbits of on-chip RAM supports buffering, small frame storage, and lookup operations.
• Compact, High-Density Modules  The 1760-FCBGA surface-mount package supports compact board layouts where a high logic count in a single package is required.

Unique Advantages

• High logic capacity: 110,592 logic elements enable implementation of large, integrated digital functions in a single FPGA.
• Substantial on-chip RAM: Approximately 4.7 Mbits of embedded memory reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O: 800 I/O pins provide flexibility for multi-channel connectivity and dense external interfacing.
• Surface-mount BGA package: 1760-FCBGA (42.5×42.5) supports high-density PCB assembly and integration into compact systems.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Meets RoHS requirements for environmental compliance.

Why Choose XC5VLX110-2FF1760C?

The XC5VLX110-2FF1760C from AMD combines a large logic element count, substantial embedded RAM, and a high I/O count in a compact 1760-FCBGA surface-mount package. It is suited for projects that require significant on-chip programmable logic and dense external interfacing within a commercial temperature envelope.

This device is appropriate for engineering teams and procurement seeking a commercially rated FPGA with high logic density, integrated memory, and wide I/O capability, delivered in a package format compatible with surface-mount production processes.

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