XC5VLX110-1FFG676CES

The XC5VLX110-1FFG676CES is a field programmable gate array (FPGA) device from AMD designed for high-density, reconfigurable digital logic. It combines 110,592 logic elements, approximately 4.7 Mbits of embedded memory, and 440 user I/O to support complex, I/O-rich designs in a single surface-mount package.

Packaged in a 676-FCBGA (27 × 27) ball-grid array and specified for commercial operation, this device targets applications that require significant on-chip logic and memory integration within a compact footprint.

Key Features

• Core Logic  110,592 logic elements provide a large fabric for implementing custom digital functions and complex, parallel logic architectures.
• Embedded Memory  Approximately 4.7 Mbits of on-chip RAM for buffering, look-up tables, and local data storage without external memory.
• I/O Capacity  440 user I/O pins enable dense interfacing and multiple parallel channels for sensors, peripherals, or high-speed interfaces.
• Power Supply  Core voltage range of 0.95 V to 1.05 V to match system power-rail requirements.
• Package & Mounting  676-BBGA / FCBGA package (27 × 27) optimized for surface-mount PCB assembly and compact system integration.
• Operating Grade & Temperature  Commercial grade device rated for 0 °C to 85 °C operation.
• RoHS Compliance  Manufactured to meet RoHS environmental standards.

Typical Applications

• Custom Digital Logic & Prototyping: Use the large logic capacity for implementing complex control, algorithm acceleration, and prototype systems where reconfigurability is required.
• I/O-Intensive Systems: Leverage 440 I/Os for multi-channel data acquisition, protocol bridging, or systems that require many external connections.
• Embedded Memory Buffering: On-chip RAM (approximately 4.7 Mbits) supports local buffering and temporary data storage to reduce external memory dependence.
• Compact Surface-Mount Designs: The 676-FCBGA package allows integration into space-constrained PCBs where high logic density and a small footprint are priorities.

Unique Advantages

• High Logic Density: 110,592 logic elements enable consolidation of complex logic functions into a single device, reducing system-level component count.
• Substantial On-Chip Memory: Approximately 4.7 Mbits of embedded RAM provides local storage for buffering and intermediate data processing, simplifying memory architecture.
• Extensive I/O Resources: 440 user I/Os support broad peripheral and interface connectivity without additional I/O expanders.
• Compact, Surface-Mount Package: The 676-FCBGA (27 × 27) form factor supports dense PCB layouts and modern assembly workflows.
• Commercial Temperature Support: Rated 0 °C to 85 °C for a wide range of standard electronics applications.
• RoHS Compliant: Meets environmental requirements for lead-free assembly and standard regulatory expectations.

Why Choose XC5VLX110-1FFG676CES?

The XC5VLX110-1FFG676CES positions itself as a high-capacity, commercially rated FPGA suitable for designs requiring substantial logic, embedded memory, and dense I/O in a compact surface-mount package. Its balance of logic elements, on-chip RAM, and I/O count makes it appropriate for system designers consolidating multiple functions into a single programmable device.

Backed by AMD as the manufacturer and provided in a RoHS-compliant FCBGA package, this device offers a scalable platform for commercial embedded applications where reprogrammability, integration, and a small PCB footprint are important considerations.

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