XC5VLX110-1FFG1153I

The XC5VLX110-1FFG1153I is a Virtex‑5 LX Field Programmable Gate Array (FPGA) from AMD, designed for industrial-grade programmable logic applications. It delivers a large logic fabric and on-chip memory in a compact FCBGA package suitable for surface-mount assembly.

With 110,592 logic elements, approximately 4.72 Mbits of embedded memory and 800 I/Os, this device targets designs that require high logic density, significant on-chip RAM and extensive external interfacing within an industrial operating range.

Key Features

• Core Architecture  Virtex‑5 LX FPGA family device providing field‑programmable logic for custom digital designs.
• Logic Capacity  110,592 logic elements to implement complex logic functions and wide datapaths.
• On‑Chip Memory  Approximately 4.72 Mbits of embedded memory for buffering, FIFOs and on‑chip data storage.
• I/O Resources  800 user I/Os to support extensive external connectivity and parallel interfaces.
• Power Supply  Core voltage operating range from 950 mV to 1.05 V for compatible power architectures.
• Package & Mounting  1153‑FCBGA package (35 × 35 mm) / 1153‑BBGA form factor, surface‑mount for board‑level integration.
• Industrial Grade & Temperature  Rated for industrial operation from −40 °C to 100 °C, suitable for harsher environments.
• Compliance  RoHS‑compliant construction for environmental and regulatory alignment.

Typical Applications

• Industrial Control Systems  Implement custom control logic, motor control interfaces and deterministic I/O handling using the high logic density and wide I/O count.
• High‑Density I/O Aggregation  Aggregate or translate large numbers of signals between subsystems using 800 available I/Os and on‑chip memory for buffering.
• Custom Digital Processing  Realize application‑specific datapaths and parallel processing engines leveraging the 110,592 logic elements and embedded memory.

Unique Advantages

• High Logic Density: 110,592 logic elements enable implementation of complex, large‑scale digital designs in a single device.
• Significant Embedded Memory: Approximately 4.72 Mbits of on‑chip RAM reduces external memory dependence and simplifies board design.
• Extensive I/O Capability: 800 I/Os provide flexibility for interfacing to multiple peripherals, sensors and external buses.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Compact FCBGA Package: 1153‑FCBGA (35 × 35 mm) keeps board footprint controlled while supporting high pin counts.
• Regulatory Alignment: RoHS compliance supports products targeting regulated markets.

Why Choose XC5VLX110-1FFG1153I?

The XC5VLX110-1FFG1153I combines substantial logic resources, meaningful on‑chip memory and a large I/O complement in an industrial‑rated FCBGA package. It is positioned for designs that require high integration of custom digital logic and deterministic interfacing in harsher operating environments.

This device is well suited to engineering teams focused on scalable, robust FPGA-based solutions where board space, extensive I/O and embedded memory are important design drivers. The combination of industrial temperature range and RoHS compliance supports long-term deployment and regulatory needs.

Request a quote or submit your requirements to receive pricing and availability for the XC5VLX110-1FFG1153I. Our team can assist with lead time information and volume pricing to support your design schedule.