XC5VFX70T-2FF1136C

The XC5VFX70T-2FF1136C is a Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC from AMD designed for high-density programmable logic applications. It combines a large logic capacity with substantial embedded RAM and a high I/O count to support complex digital designs that require extensive on-chip resources and flexible interfacing.

Packaged in a 1136-FCBGA (35×35) surface-mount package and rated for commercial temperature operation, this device targets designs that need significant logic, memory and I/O capability within a compact footprint.

Key Features

• Logic Capacity  Approximately 71,680 logic elements, providing ample resources for complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 5.46 Mbits of on-chip RAM (5,455,872 bits) to support buffering, data storage and memory-intensive algorithms without external DRAM.
• I/O Density  640 user I/O pins to accommodate wide parallel interfaces, multiple high-pin-count peripherals or extensive sensor and actuator connectivity.
• Package and Mounting  1136-FCBGA (35×35) package in a surface-mount format for compact board-level integration.
• Power Supply  Core voltage supply range of 0.95 V to 1.05 V, enabling predictable core power requirements.
• Temperature Range  Commercial grade operation from 0 °C to 85 °C for deployments in standard commercial environments.
• Standards Compliance  RoHS compliant construction for environmental and regulatory alignment.

Typical Applications

• Complex Digital Systems  Use the device’s 71,680 logic elements and embedded RAM to implement large finite state machines, protocol stacks or custom accelerators in FPGA-based systems.
• I/O-Intensive Interfaces  With 640 I/O pins, integrate multiple parallel buses, sensor arrays or mixed-signal front ends that require extensive pin availability.
• Embedded Memory-Centric Designs  Leverage approximately 5.46 Mbits of on-chip RAM for buffering, FIFO implementation and local data storage to reduce external memory dependency.
• Compact Board-Level Integration  The 1136-FCBGA (35×35) surface-mount package supports high-density PCB layouts where board real estate is constrained.

Unique Advantages

• High Logic Density:  71,680 logic elements allow integration of sizeable custom logic functions on a single device, reducing the need for multiple FPGAs.
• Significant On-Chip Memory:  Approximately 5.46 Mbits of embedded RAM supports data-heavy functions and local buffering, simplifying system memory architecture.
• Large I/O Count:  640 I/O pins enable direct interfacing to numerous peripherals and wide parallel buses without extensive external multiplexing.
• Compact, Surface-Mount Package:  The 1136-FCBGA (35×35) form factor offers a balance of high integration and compact board footprint for dense designs.
• Commercial Temperature Suitability:  Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• Regulatory Alignment:  RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XC5VFX70T-2FF1136C?

The XC5VFX70T-2FF1136C positions itself as a high-capacity, memory-rich FPGA option from AMD suitable for designers who need substantial on-chip logic, embedded RAM and broad I/O in a compact package. Its combination of 71,680 logic elements, approximately 5.46 Mbits of RAM and 640 I/O pins supports integration of complex digital functions while minimizing external component count.

This device is well suited for teams and projects focused on high-density programmable logic implementations, extensive I/O interfacing and compact board-level integration, delivering design scalability and predictable electrical and thermal operating windows for commercial applications.

Request a quote or submit a pricing inquiry to evaluate the XC5VFX70T-2FF1136C for your next project.