XC5VFX70T-1FFG665C

The XC5VFX70T-1FFG665C is a Virtex®-5 FXT field programmable gate array (FPGA) IC from AMD supplied in a 665‑FCBGA (27×27) package. It provides a high logic capacity and on-chip memory combined with a large I/O count for demanding commercial designs.

Key device attributes include 71,680 logic elements, approximately 5.456 Mbits of embedded RAM, 360 I/Os, and a core voltage supply range of 0.95 V to 1.05 V, with commercial-grade operation from 0 °C to 85 °C.

Key Features

• Core Capacity 71,680 logic elements provide substantial programmable logic resources for implementing complex digital functions.
• Embedded Memory Approximately 5.456 Mbits of on-chip RAM to support buffering, lookup tables, and other memory-intensive tasks.
• I/O Count 360 general-purpose I/Os for high-density interfacing to peripherals, sensors, and other system components.
• Package 665‑ball FCBGA package (27×27) in a surface-mount format for compact board-level integration.
• Power Core voltage supply range of 0.95 V to 1.05 V to match system power design constraints.
• Temperature and Grade Commercial-grade operation with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant to meet common environmental requirements for lead-free assembly.

Typical Applications

• Custom digital logic — Implement complex, high-density digital functions using the device’s 71,680 logic elements and embedded memory.
• High-density I/O interfacing — Use 360 I/Os to connect multiple peripherals, sensors, or parallel interfaces on a single FPGA.
• On-chip buffering and data handling — Leverage approximately 5.456 Mbits of embedded RAM for buffering, FIFOs, and temporary storage in data-path designs.

Unique Advantages

• High logic capacity: 71,680 logic elements enable implementation of large-scale digital systems without external programmable logic.
• Substantial embedded memory: Approximately 5.456 Mbits of on-chip RAM reduces the need for external memory in many designs.
• Extensive I/O resources: 360 I/Os support complex interfacing and parallel connectivity requirements.
• Compact ball-grid package: 665‑FCBGA (27×27) provides a dense footprint for board-level space savings while supporting surface-mount assembly.
• Commercial temperature range and RoHS compliance: Suitable for standard commercial deployments with lead-free manufacturing compatibility.
• Defined core voltage range: 0.95 V to 1.05 V simplifies power-supply design and integration with system rails.

Why Choose XC5VFX70T-1FFG665C?

The XC5VFX70T-1FFG665C balances a high count of logic elements, significant embedded memory, and a large I/O complement in a compact 665‑FCBGA package, addressing commercial designs that require dense programmable logic and on-chip storage. Its specified core voltage range and commercial operating temperature make it suitable for a wide range of board-level implementations.

This Virtex®-5 FXT device is appropriate for engineers and procurement teams looking for a well-specified FPGA building block with clear electrical, thermal, and packaging parameters from AMD.

Request a quote or submit an inquiry to receive pricing and availability information for the XC5VFX70T-1FFG665C. Our team can assist with ordering and lead-time details tailored to your project requirements.