XC5VFX70T-1FF665I

The XC5VFX70T-1FF665I is a Virtex-5 FXT field-programmable gate array (FPGA) integrated circuit in a 665-ball FCBGA package. It combines high logic density, substantial on-chip memory, and a large I/O count to address complex programmable logic designs.

Key physical and operating parameters include 71,680 logic elements, approximately 5.456 Mbits of embedded memory, 360 I/Os, a core supply range of 0.95 V to 1.05 V, and an industrial temperature rating from −40 °C to 100 °C.

Key Features

• Core Capacity  Provides 71,680 logic elements suitable for high-density programmable logic implementations.
• Embedded Memory  Approximately 5.456 Mbits of on-chip RAM to support data buffering, FIFOs, and on-chip storage.
• I/O Resources  360 general-purpose I/O pins enable extensive external connectivity for interfaces and peripherals.
• Power  Core voltage supply range of 0.95 V to 1.05 V to match system power architecture requirements.
• Package and Mounting  665-ball FCBGA (665-FCBGA, 27×27) in a surface-mount package for board-level integration.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance  RoHS-compliant construction for regulatory and environmental considerations.

Typical Applications

• High-density logic systems  Leverage 71,680 logic elements and embedded memory to implement complex, custom digital logic functions on a single device.
• Embedded data buffering  Approximately 5.456 Mbits of on-chip RAM support packet buffering, temporary storage, and data path staging.
• Multi-channel I/O systems  360 I/Os provide the signal density needed for designs requiring extensive peripheral or bus connections.
• Industrial control equipment  Industrial temperature rating (−40 °C to 100 °C) fits designs that must operate across wide ambient conditions.

Unique Advantages

• High logic and memory capacity: The combination of 71,680 logic elements and approximately 5.456 Mbits of embedded RAM enables integration of large custom logic blocks and data structures on-chip.
• Extensive I/O count: 360 I/Os simplify board-level routing for multi-interface systems and reduce the need for additional I/O expanders.
• Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in environments with wide temperature variation.
• Surface-mount FCBGA packaging: 665-FCBGA (27×27) provides a compact, high-density package option for space-constrained designs.
• Controlled core power range: 0.95 V to 1.05 V core supply range supports controlled power budgeting and integration with system power rails.
• RoHS compliant: Meets RoHS environmental compliance requirements for lead-free assembly processes.

Why Choose XC5VFX70T-1FF665I?

The XC5VFX70T-1FF665I positions itself for designs that require substantial programmable logic, embedded memory, and a high number of I/Os within an industrial-rated FPGA. Its combination of 71,680 logic elements, approximately 5.456 Mbits of on-chip RAM, and 360 I/Os makes it suitable for consolidating complex digital functions onto a single device.

This device is appropriate for engineering teams and procurement looking for a robust, RoHS-compliant FPGA in a 665-ball FCBGA surface-mount package, with power and thermal specifications that match industrial applications. The part provides long-term design value through high integration density and operational resilience across a wide temperature range.

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