XC5VFX70T-1FF665C
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 360 5455872 71680 665-BBGA, FCBGA |
|---|---|
| Quantity | 898 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5600 | Number of Logic Elements/Cells | 71680 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5455872 |
Overview of XC5VFX70T-1FF665C – Virtex®-5 FXT FPGA, 665-FCBGA (Commercial)
The XC5VFX70T-1FF665C is a Virtex®-5 FXT field programmable gate array (FPGA) IC supplied in a 665-ball FCBGA package. It provides a balance of programmable logic resources, on-chip memory, and I/O capacity for complex, board-level digital designs.
Key on-chip resources include 5,600 CLBs, 71,680 logic elements, and approximately 5.46 Mbits of embedded memory, with up to 360 I/O pins. The device operates from a core supply range of 0.95 V to 1.05 V and is specified for commercial temperature operation (0 °C to 85 °C).
Key Features
- Programmable Logic Resources 5,600 CLBs delivering 71,680 logic elements for implementing complex digital logic and custom architectures.
- Embedded Memory Approximately 5.46 Mbits of on-chip RAM to support buffering, packet processing, and local data storage.
- I/O Capacity Up to 360 I/O pins to support wide parallel interfaces, multiple peripheral connections, and board-level integration.
- Package and Mounting 665-ball FCBGA (27 mm × 27 mm) surface-mount package for high-density PCB implementations.
- Power and Supply Core supply range from 0.95 V to 1.05 V to match system power-rail designs and enable predictable power behavior.
- Temperature Grade Commercial operating range from 0 °C to 85 °C for typical electronics and embedded applications.
- Environmental Compliance RoHS-compliant construction for regulatory and manufacturing compatibility.
Typical Applications
- High-density programmable logic — Implement complex state machines, protocol engines, and custom processing pipelines using the device's 71,680 logic elements and 5,600 CLBs.
- On-chip buffering and memory tasks — Use approximately 5.46 Mbits of embedded RAM for data buffering, FIFOs, and temporary storage in data-path designs.
- Multi-interface system integration — Leverage up to 360 I/O pins to interface with multiple peripherals, parallel buses, and board-level subsystems.
Unique Advantages
- Substantial logic capacity: 71,680 logic elements provide the resource headroom needed for sizable logic implementations without immediate device scaling.
- Significant on-chip memory: Approximately 5.46 Mbits of embedded RAM reduces reliance on external memory for many buffering and data-stream tasks.
- High I/O count: 360 I/O pins support rich connectivity and simplify board-level routing for multi-peripheral systems.
- Compact FCBGA package: The 665-ball, 27×27 mm FCBGA enables high-density PCB layouts while keeping the device footprint manageable.
- Commercial temperature rating: Specified for 0 °C to 85 °C operation to meet common embedded and consumer application requirements.
- RoHS compliant: Built to meet environmental compliance expectations for modern electronics manufacturing.
Why Choose XC5VFX70T-1FF665C?
The XC5VFX70T-1FF665C positions itself as a commercially rated Virtex®-5 FXT FPGA option that combines large programmable logic capacity, meaningful on-chip memory, and a high I/O count in a 665-ball FCBGA package. Its electrical and thermal specifications make it suitable for designs that require substantial on-chip resources while conforming to standard commercial temperature ranges.
This device is well suited for engineering teams and procurement seeking a robust FPGA building block for board-level systems that need scaleable logic, embedded RAM, and extensive I/O in a surface-mount BGA footprint, with RoHS compliance for modern manufacturing processes.
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