XC5VFX70T-1FFG1136C

The XC5VFX70T-1FFG1136C is a Virtex‑5 FXT FPGA IC from AMD engineered for high‑density, I/O‑rich FPGA designs. It combines a large logic fabric with significant on‑chip memory and a high pin‑count FCBGA package to support complex digital processing tasks in commercial applications.

Key hardware attributes include 71,680 logic elements, approximately 5.46 Mbits of embedded RAM, 640 user I/O pins, and a 1136‑ball FCBGA package. The device is rated for commercial operation and RoHS compliant.

Key Features

• Logic Capacity  71,680 logic elements for implementing complex combinational and sequential logic functions.
• Embedded Memory  Approximately 5.46 Mbits of on‑chip RAM to support buffer, FIFO and local data storage needs without external memory in many designs.
• I/O Density  640 user I/O pins to accommodate wide parallel interfaces and multiple high‑pin‑count peripherals.
• Power Supply Range  Core voltage range from 0.95 V to 1.05 V to match system power rails and enable predictable power budgeting.
• Package and Mounting  1136‑FCBGA (35 × 35 mm) ball grid array in a surface‑mount package for dense board integration and reliable solder connections.
• Operating Range  Commercial temperature rating of 0 °C to 85 °C for standard environment deployments.
• Regulatory  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High‑density digital processing  Use the large logic capacity and embedded RAM to implement complex state machines, data path processing, and algorithm acceleration.
• Multi‑interface systems  Leverage 640 I/Os to connect parallel buses, multiple peripheral interfaces, and wide I/O subsystems on a single device.
• On‑board buffering and local memory  Utilize the approximately 5.46 Mbits of embedded RAM for buffering, FIFOs, and temporary data storage without relying on external memory.

Unique Advantages

• High logic integration: 71,680 logic elements reduce the need for multiple discrete devices and simplify system architecture.
• Substantial on‑chip memory: Approximately 5.46 Mbits of embedded RAM supports local data handling and accelerates data‑intensive tasks.
• Large I/O complement: 640 I/Os enable direct connection to numerous peripherals and wide buses, minimizing external interface components.
• Compact FCBGA packaging: The 1136‑ball FCBGA (35 × 35 mm) balances high pin count with a compact board footprint for dense designs.
• Commercial grade and RoHS compliant: Designed for standard commercial environments with regulatory compliance for common manufacturing processes.
• Predictable core power range: Specified 0.95–1.05 V supply simplifies power supply selection and system power planning.

Why Choose XC5VFX70T-1FFG1136C?

The XC5VFX70T‑1FFG1136C positions itself as a high‑capacity, I/O‑rich FPGA for commercial applications that require substantial logic resources and embedded memory in a single device. Its combination of 71,680 logic elements, roughly 5.46 Mbits of on‑chip RAM, and 640 I/Os provides a platform for consolidating complex digital functions while reducing board‑level component count.

This device is well suited for design teams seeking a scalable FPGA fabric with a compact FCBGA package, predictable power requirements, and RoHS compliance. It delivers the integration and robustness needed to support medium to high complexity designs across a range of commercial deployments.

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