XC5VFX70T-1FFG665I
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 360 5455872 71680 665-BBGA, FCBGA |
|---|---|
| Quantity | 778 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5600 | Number of Logic Elements/Cells | 71680 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5455872 |
Overview of XC5VFX70T-1FFG665I – Virtex®-5 FXT FPGA, 665-FCBGA (27×27)
The XC5VFX70T-1FFG665I is a Virtex®-5 FXT field programmable gate array (FPGA) provided by AMD. It offers a high logic capacity FPGA architecture with substantial embedded memory and a large I/O count for designs that require dense logic implementation and flexible interfacing.
Designed for industrial environments, this device supports low-voltage core operation and a wide operating temperature range, enabling use in applications that demand reliable performance across varied conditions.
Key Features
- Core Capacity Contains 71,680 logic elements to implement complex custom logic and control functions.
- Embedded Memory Includes approximately 5.46 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
- I/O Resources Offers 360 general-purpose I/O pins to support multiple external interfaces and peripherals.
- Power Operates with a core voltage supply range of 950 mV to 1.05 V to match low-voltage system architectures.
- Package & Mounting Supplied in a 665-FCBGA package (27×27) / 665-BBGA case and intended for surface-mount assembly.
- Temperature & Grade Rated for industrial use with an operating temperature range of −40°C to 100°C.
- RoHS Compliance Manufactured in compliance with RoHS requirements.
Typical Applications
- Industrial Automation Industrial-grade temperature range and high logic density make this FPGA suitable for control systems and process automation where reliability across temperatures is required.
- Embedded Processing Large logic capacity and on-chip RAM support custom embedded data-paths, state machines, and protocol handling.
- High-Density I/O Systems With 360 I/O pins, the device supports systems that require multiple sensors, actuators, or peripheral interfaces.
- Prototyping and Custom Hardware The combination of logic elements and embedded memory enables rapid hardware prototyping and tailored hardware acceleration for specialized tasks.
Unique Advantages
- High Logic Capacity: 71,680 logic elements provide the resources to implement complex, multi-function designs on a single device.
- Substantial On-Chip Memory: Approximately 5.46 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
- Extensive I/O Count: 360 I/O pins allow flexible integration with a wide range of external components and subsystems without immediate need for additional multiplexing hardware.
- Industrial Temperature Rating: −40°C to 100°C operation supports deployment in harsh or temperature-variable environments.
- Compact, Surface-Mount FCBGA Package: The 665-FCBGA (27×27) package delivers high pin density in a compact footprint for space-constrained boards.
- Low-Voltage Core Operation: 0.95–1.05 V supply range aligns with low-voltage system designs and power-sensitive applications.
Why Choose XC5VFX70T-1FFG665I?
The XC5VFX70T-1FFG665I positions itself as a high-capacity, industrial-grade FPGA that combines substantial logic resources, embedded memory, and a large I/O complement in a compact FCBGA package. Its electrical and thermal specifications make it suitable for designs that require reliable, long-term operation across a wide temperature range.
This device is appropriate for engineers and teams building complex embedded systems, industrial controllers, and custom hardware accelerators who need a single FPGA platform that consolidates logic, memory, and interfacing while benefiting from AMD's manufacturing and product support.
If you would like pricing, availability, or technical clarification for XC5VFX70T-1FFG665I, request a quote or submit an inquiry to discuss your specific requirements and lead-time options.

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