XC5VFX30T-2FFG665C

The XC5VFX30T-2FFG665C is a Virtex®-5 FXT field programmable gate array (FPGA) IC from AMD. It combines a high logic element count with substantial on-chip RAM and a large I/O complement in a 665-FCBGA package, targeting designs that require dense logic, embedded memory, and high I/O connectivity.

This device is supplied as a surface-mount FCBGA package and is specified for commercial-grade operation, making it suitable for mainstream embedded and electronic system designs that operate within a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity  Provides 32,768 logic elements to implement complex combinational and sequential logic functions within a single device.
• Embedded Memory  Contains approximately 2.5 Mbits of total on-chip RAM (2,506,752 bits) for data buffering, FIFOs, and local storage.
• I/O Density  360 general-purpose I/O pins enable broad external connectivity and flexible interfacing to peripherals and subsystems.
• Power Domains  Core supply specified at 950 mV to 1.05 V, enabling defined power planning for core voltage rails in system designs.
• Package & Mounting  665-FCBGA package (665-BBGA, supplier device package: 665-FCBGA (27x27)) in a surface-mount configuration for board-level integration where package density is required.
• Operating Range  Commercial-grade operating temperature range of 0 °C to 85 °C for standard temperature environments.
• Regulatory  RoHS compliant, supporting lead-free assembly and regulatory requirements for many commercial electronic products.

Unique Advantages

• High logic density: 32,768 logic elements provide the capacity to consolidate multiple functions into one FPGA, simplifying board-level design and reducing external component count.
• Substantial on-chip memory: Approximately 2.5 Mbits of embedded RAM supports local buffering and data handling, minimizing reliance on external memory in many designs.
• Extensive I/O: 360 I/O pins allow flexible interfacing to a wide range of peripherals, sensors, and high-pin-count connectors without immediate need for I/O expanders.
• Compact, high-density package: The 665-FCBGA package consolidates routing and component placement, enabling dense PCB implementations while supporting surface-mount assembly processes.
• Defined power supply window: A specified core voltage range of 0.95 V to 1.05 V aids in precise power-supply design and thermal planning for the FPGA core.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial applications and supply-chain requirements.

Why Choose XC5VFX30T-2FFG665C?

The XC5VFX30T-2FFG665C is positioned for developers who need a combination of high logic capacity, meaningful embedded memory, and a large I/O count in a single, surface-mount FPGA package. Its 32,768 logic elements and approximately 2.5 Mbits of on-chip RAM enable integration of complex functions and buffering without immediately resorting to multiple discrete components.

This device is well suited to commercial electronic designs where package density, predictable core voltage requirements, and RoHS compliance are important. The 665-FCBGA package and commercial operating range make it a practical choice for systems engineers and procurement teams building mainstream embedded systems.

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