XC5VFX30T-1FFG665I

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 360 2506752 32768 665-BBGA, FCBGA

Quantity 913 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells32768
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2506752

Overview of XC5VFX30T-1FFG665I – Virtex®-5 FXT FPGA, 32,768 Logic Elements, 360 I/O

The XC5VFX30T-1FFG665I is a Virtex-5 FXT field programmable gate array (FPGA) IC designed for industrial applications. It provides a balance of logic capacity, embedded memory, and I/O density in a 665‑FCBGA (27×27) surface‑mount package.

This device targets applications that require reconfigurable logic with defined power and thermal operating ranges, offering on‑chip memory and a large complement of programmable I/O pins to support complex system integration.

Key Features

  • Logic Capacity  32,768 logic elements and 2,560 configurable logic blocks (CLBs) to implement custom digital functions and state machines.
  • Embedded Memory  Approximately 2.5 Mbits of on‑chip RAM for data buffering, FIFOs, and small lookup tables.
  • I/O Density  360 programmable I/O pins to support multiple parallel interfaces and high‑pin‑count system connections.
  • Package & Mounting  665‑pin FCBGA package (27×27) in a surface‑mount form factor for compact board integration.
  • Power Supply  Core voltage support from 0.950 V to 1.05 V, enabling defined power domain design and supply planning.
  • Operating Temperature  Industrial operating range from −40 °C to 100 °C for deployment in temperature‑variable environments.
  • Compliance  RoHS‑compliant lead‑free construction to meet environmental and regulatory requirements.

Unique Advantages

  • Substantial logic resources: 32,768 logic elements and 2,560 CLBs provide the headroom to implement moderate to complex FPGA designs without external logic.
  • On‑chip memory for data handling: Approximately 2.5 Mbits of embedded RAM reduces the need for external memory in many buffering and latency‑sensitive tasks.
  • High I/O count: 360 I/O pins support broad interfacing options and simplify board-level routing for multi‑lane or multi‑bus systems.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployments in thermally demanding environments.
  • Compact, surface‑mount package: The 665‑FCBGA (27×27) package allows a high pin count in a compact footprint for space‑constrained designs.
  • RoHS compliance: Lead‑free construction supports environmentally conscious product designs and regulatory compliance.

Why Choose XC5VFX30T-1FFG665I?

The XC5VFX30T-1FFG665I positions itself as a versatile Virtex‑5 FXT FPGA option that combines sizable logic and memory resources with a high I/O count and an industrial temperature rating. Its defined core voltage range and surface‑mount 665‑FCBGA package make it suitable for engineering designs that require compact integration and predictable electrical characteristics.

This device is appropriate for engineering teams needing a reprogrammable silicon building block offering medium‑to‑large logic capacity, embedded RAM, and extensive I/O while meeting RoHS requirements and industrial thermal constraints.

Request a quote or submit an inquiry for pricing and availability to begin integrating the XC5VFX30T-1FFG665I into your next design.

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