XC5VFX30T-1FFG665I
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 360 2506752 32768 665-BBGA, FCBGA |
|---|---|
| Quantity | 913 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2560 | Number of Logic Elements/Cells | 32768 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2506752 |
Overview of XC5VFX30T-1FFG665I – Virtex®-5 FXT FPGA, 32,768 Logic Elements, 360 I/O
The XC5VFX30T-1FFG665I is a Virtex-5 FXT field programmable gate array (FPGA) IC designed for industrial applications. It provides a balance of logic capacity, embedded memory, and I/O density in a 665‑FCBGA (27×27) surface‑mount package.
This device targets applications that require reconfigurable logic with defined power and thermal operating ranges, offering on‑chip memory and a large complement of programmable I/O pins to support complex system integration.
Key Features
- Logic Capacity 32,768 logic elements and 2,560 configurable logic blocks (CLBs) to implement custom digital functions and state machines.
- Embedded Memory Approximately 2.5 Mbits of on‑chip RAM for data buffering, FIFOs, and small lookup tables.
- I/O Density 360 programmable I/O pins to support multiple parallel interfaces and high‑pin‑count system connections.
- Package & Mounting 665‑pin FCBGA package (27×27) in a surface‑mount form factor for compact board integration.
- Power Supply Core voltage support from 0.950 V to 1.05 V, enabling defined power domain design and supply planning.
- Operating Temperature Industrial operating range from −40 °C to 100 °C for deployment in temperature‑variable environments.
- Compliance RoHS‑compliant lead‑free construction to meet environmental and regulatory requirements.
Unique Advantages
- Substantial logic resources: 32,768 logic elements and 2,560 CLBs provide the headroom to implement moderate to complex FPGA designs without external logic.
- On‑chip memory for data handling: Approximately 2.5 Mbits of embedded RAM reduces the need for external memory in many buffering and latency‑sensitive tasks.
- High I/O count: 360 I/O pins support broad interfacing options and simplify board-level routing for multi‑lane or multi‑bus systems.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployments in thermally demanding environments.
- Compact, surface‑mount package: The 665‑FCBGA (27×27) package allows a high pin count in a compact footprint for space‑constrained designs.
- RoHS compliance: Lead‑free construction supports environmentally conscious product designs and regulatory compliance.
Why Choose XC5VFX30T-1FFG665I?
The XC5VFX30T-1FFG665I positions itself as a versatile Virtex‑5 FXT FPGA option that combines sizable logic and memory resources with a high I/O count and an industrial temperature rating. Its defined core voltage range and surface‑mount 665‑FCBGA package make it suitable for engineering designs that require compact integration and predictable electrical characteristics.
This device is appropriate for engineering teams needing a reprogrammable silicon building block offering medium‑to‑large logic capacity, embedded RAM, and extensive I/O while meeting RoHS requirements and industrial thermal constraints.
Request a quote or submit an inquiry for pricing and availability to begin integrating the XC5VFX30T-1FFG665I into your next design.

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