XC5VFX30T-1FF665I

The XC5VFX30T-1FF665I is a Virtex®-5 FXT field programmable gate array (FPGA) from AMD designed for industrial applications. It combines substantial logic capacity, multi-megabit embedded memory, and extensive I/O in a 665‑ball FCBGA package to address embedded system designs that require on-chip resources and industrial temperature operation.

Key Features

• Logic Capacity — 32,768 logic elements implemented across 2,560 logic blocks, providing significant on-chip programmable fabric for custom logic and control functions.
• Embedded Memory — Approximately 2.51 Mbits of on-chip RAM, suitable for buffering, packet or frame storage, and local data processing.
• I/O Density — 360 general-purpose I/O pins to support wide external connectivity and parallel interfaces.
• Power Supply — Core voltage support from 0.95 V to 1.05 V, enabling predictable power domain planning for system integration.
• Package & Mounting — 665‑ball FCBGA (27 × 27 mm) surface-mount package for compact board-level integration and controlled thermal/power characteristics.
• Operating Range — Industrial-grade operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Standards Compliance — RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control and Automation — Industrial temperature rating and a high I/O count make this FPGA suitable for control logic, I/O aggregation, and machine automation tasks.
• Embedded Signal Processing — Large logic capacity and on-chip RAM support real-time processing pipelines and data buffering in embedded signal and communications functions.
• Custom Interface Bridges — With 360 I/O pins, the device can implement protocol translation, parallel bus mastering, or multi-channel data aggregation on a single chip.

Unique Advantages

• High programmable density: 32,768 logic elements enable complex custom logic and integration of multiple functions into one device, reducing board-level BOM and latency between functions.
• Multi-megabit embedded RAM: Approximately 2.51 Mbits of on-chip memory supports buffering and local data processing without external memory dependencies.
• Extensive external connectivity: 360 I/O pins provide flexibility for interfacing with sensors, peripherals, and high-pin-count connectors.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
• Compact FCBGA package: 665-ball, 27 × 27 mm FCBGA allows high-density integration on modern PCBs while maintaining surface-mount assembly compatibility.
• Regulatory compliance: RoHS compliance supports lead-free manufacturing and regulatory requirements.

Why Choose XC5VFX30T-1FF665I?

The XC5VFX30T-1FF665I positions itself as a robust, industrial-grade FPGA option that balances sizable logic and memory resources with a high I/O count and a compact FCBGA footprint. It is well suited for designs that require on-chip processing, extensive external interfacing, and operation across a wide temperature range.

Manufactured by AMD, this device is appropriate for engineers and procurement teams seeking a field-programmable solution that consolidates multiple functions on a single IC, simplifying system architecture and reducing component count.

Request a quote or submit an inquiry to obtain pricing and availability for the XC5VFX30T-1FF665I and to discuss how it can fit into your next industrial or embedded design.