XC5VFX30T-1FFG665CES

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 360 2506752 32768 665-BBGA, FCBGA

Quantity 1,885 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells32768
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2506752

Overview of XC5VFX30T-1FFG665CES – Virtex®-5 FXT Field Programmable Gate Array (FPGA) 665-FCBGA

The XC5VFX30T-1FFG665CES is a Virtex-5 FXT FPGA from AMD, offered in a 665-ball FCBGA package for surface-mount placement. It provides a combination of programmable logic resources, on-chip memory, and a high I/O count suitable for commercial embedded designs that require substantial integration on a single device.

This device operates within a 950 mV to 1.05 V core supply range and is specified for commercial temperature operation from 0 °C to 85 °C; it is RoHS compliant.

Key Features

  • Core & Logic  Includes 2,560 CLBs and 32,768 logic elements to implement complex programmable logic and custom datapaths.
  • Embedded Memory  Approximately 2.5 Mbits of on-chip RAM (total RAM bits: 2,506,752) for buffers, FIFOs, and on-chip storage.
  • I/O Density  360 general-purpose I/O pins to interface with peripherals, memory, and external logic.
  • Power  Core supply specified from 950 mV to 1.05 V to align with system power domains and voltage planning.
  • Package & Mounting  665-ball FCBGA package (665-FCBGA, 27×27) designed for surface-mount assembly in compact board layouts.
  • Grade & Temperature  Commercial grade operation from 0 °C to 85 °C for standard commercial electronics environments.
  • Compliance  RoHS compliant to support environmentally driven manufacturing requirements.

Unique Advantages

  • High logic density: 32,768 logic elements combined with 2,560 CLBs enable substantial on-chip implementation of complex functions without external logic.
  • Significant on-chip memory: Approximately 2.5 Mbits of embedded RAM reduces the need for some external memory components, simplifying BOM and board area.
  • Large I/O capability: 360 I/O pins provide flexible connectivity for multi-channel interfaces and parallel buses.
  • Compact FCBGA footprint: 665-ball FCBGA (27×27) balances high pin-count with a compact package suitable for dense PCB layouts.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial product deployments.
  • Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and supply requirements.

Why Choose XC5VFX30T-1FFG665CES?

The XC5VFX30T-1FFG665CES positions itself as a highly integrated Virtex-5 FXT FPGA option for commercial designs that require a balance of logic capacity, embedded memory, and extensive I/O in a single surface-mount package. Its combination of 32,768 logic elements, substantial on-chip RAM, and 360 I/Os makes it suitable for projects that demand on-chip integration to reduce external components and simplify board-level design.

Offered by AMD and delivered in a 665-FCBGA package, this device provides a stable, RoHS-compliant building block for designers seeking scalability within the Virtex-5 FXT family and straightforward integration into commercial temperature environments.

Request a quote or submit a purchase inquiry today to discuss pricing and availability for the XC5VFX30T-1FFG665CES.

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