XC5VFX30T-1FFG665CES
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 360 2506752 32768 665-BBGA, FCBGA |
|---|---|
| Quantity | 1,885 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2560 | Number of Logic Elements/Cells | 32768 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2506752 |
Overview of XC5VFX30T-1FFG665CES – Virtex®-5 FXT Field Programmable Gate Array (FPGA) 665-FCBGA
The XC5VFX30T-1FFG665CES is a Virtex-5 FXT FPGA from AMD, offered in a 665-ball FCBGA package for surface-mount placement. It provides a combination of programmable logic resources, on-chip memory, and a high I/O count suitable for commercial embedded designs that require substantial integration on a single device.
This device operates within a 950 mV to 1.05 V core supply range and is specified for commercial temperature operation from 0 °C to 85 °C; it is RoHS compliant.
Key Features
- Core & Logic Includes 2,560 CLBs and 32,768 logic elements to implement complex programmable logic and custom datapaths.
- Embedded Memory Approximately 2.5 Mbits of on-chip RAM (total RAM bits: 2,506,752) for buffers, FIFOs, and on-chip storage.
- I/O Density 360 general-purpose I/O pins to interface with peripherals, memory, and external logic.
- Power Core supply specified from 950 mV to 1.05 V to align with system power domains and voltage planning.
- Package & Mounting 665-ball FCBGA package (665-FCBGA, 27×27) designed for surface-mount assembly in compact board layouts.
- Grade & Temperature Commercial grade operation from 0 °C to 85 °C for standard commercial electronics environments.
- Compliance RoHS compliant to support environmentally driven manufacturing requirements.
Unique Advantages
- High logic density: 32,768 logic elements combined with 2,560 CLBs enable substantial on-chip implementation of complex functions without external logic.
- Significant on-chip memory: Approximately 2.5 Mbits of embedded RAM reduces the need for some external memory components, simplifying BOM and board area.
- Large I/O capability: 360 I/O pins provide flexible connectivity for multi-channel interfaces and parallel buses.
- Compact FCBGA footprint: 665-ball FCBGA (27×27) balances high pin-count with a compact package suitable for dense PCB layouts.
- Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial product deployments.
- Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and supply requirements.
Why Choose XC5VFX30T-1FFG665CES?
The XC5VFX30T-1FFG665CES positions itself as a highly integrated Virtex-5 FXT FPGA option for commercial designs that require a balance of logic capacity, embedded memory, and extensive I/O in a single surface-mount package. Its combination of 32,768 logic elements, substantial on-chip RAM, and 360 I/Os makes it suitable for projects that demand on-chip integration to reduce external components and simplify board-level design.
Offered by AMD and delivered in a 665-FCBGA package, this device provides a stable, RoHS-compliant building block for designers seeking scalability within the Virtex-5 FXT family and straightforward integration into commercial temperature environments.
Request a quote or submit a purchase inquiry today to discuss pricing and availability for the XC5VFX30T-1FFG665CES.

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