XC6SLX45T-2FGG484C

IC FPGA 296 I/O 484FBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 2138112 43661 484-BBGA

Quantity 1,130 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O296Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3411Number of Logic Elements/Cells43661
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2138112

Overview of XC6SLX45T-2FGG484C – Spartan®-6 LXT FPGA, 484-BBGA

The XC6SLX45T-2FGG484C is a Spartan®-6 LXT field programmable gate array (FPGA) in a 484-ball BGA package designed for commercial applications. It integrates a substantial logic resource and on-chip memory with high I/O density to support a broad range of embedded digital designs.

Key on-chip resources include 43,661 logic elements and approximately 2.14 Mbits of embedded memory, while system-level attributes such as 296 I/O pins, a compact 484-ball BGA package, and a 1.14–1.26 V core supply make it a practical choice for space-constrained, performance-oriented FPGA implementations within the provided operating temperature range.

Key Features

  • Core Logic 3,411 CLBs and 43,661 logic elements provide substantial programmable logic capacity for combinational and sequential implementations.
  • On-chip Memory Approximately 2.14 Mbits of embedded RAM to support buffering, lookup tables, and other memory-intensive functions.
  • I/O Resources 296 user I/O pins enable connectivity to multiple peripherals, buses, and external devices.
  • Power Core voltage supply range of 1.14 V to 1.26 V for the device core.
  • Package and Mounting 484-ball BGA package (supplier package: 484-FBGA, 23×23) in a surface-mount format for compact board-level integration.
  • Operating Range Commercial-grade operation with an ambient temperature range of 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant for lead-free manufacturing requirements.

Unique Advantages

  • High logic capacity: 43,661 logic elements support complex FPGA designs without immediate need for larger devices, reducing design fragmentation.
  • Substantial embedded memory: Approximately 2.14 Mbits of on-chip RAM enables efficient data buffering and state storage inside the FPGA fabric.
  • Extensive I/O count: 296 I/Os allow flexible interfacing to sensors, peripherals, and bus systems, simplifying board-level partitioning.
  • Compact BGA footprint: 484-ball BGA (23×23) provides a dense, surface-mount package suitable for space-constrained PCBs.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching many consumer and industrial-adjacent deployments.
  • Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements for modern electronics production.

Why Choose XC6SLX45T-2FGG484C?

The XC6SLX45T-2FGG484C balances substantial programmable logic, embedded memory, and extensive I/O in a compact 484-ball BGA package, making it well-suited for designers who need a mid-range FPGA resource set within commercial temperature bounds. Its defined core voltage range and surface-mount package facilitate integration into mainstream PCB assemblies.

This device is appropriate for teams and projects that require a reliable, RoHS-compliant FPGA platform with measurable logic and memory resources, enabling scalable designs and straightforward board-level implementation without speculation on unsupported attributes.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC6SLX45T-2FGG484C.

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