XC6SLX45T-2FGG484C
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 2138112 43661 484-BBGA |
|---|---|
| Quantity | 1,130 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 296 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3411 | Number of Logic Elements/Cells | 43661 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2138112 |
Overview of XC6SLX45T-2FGG484C – Spartan®-6 LXT FPGA, 484-BBGA
The XC6SLX45T-2FGG484C is a Spartan®-6 LXT field programmable gate array (FPGA) in a 484-ball BGA package designed for commercial applications. It integrates a substantial logic resource and on-chip memory with high I/O density to support a broad range of embedded digital designs.
Key on-chip resources include 43,661 logic elements and approximately 2.14 Mbits of embedded memory, while system-level attributes such as 296 I/O pins, a compact 484-ball BGA package, and a 1.14–1.26 V core supply make it a practical choice for space-constrained, performance-oriented FPGA implementations within the provided operating temperature range.
Key Features
- Core Logic 3,411 CLBs and 43,661 logic elements provide substantial programmable logic capacity for combinational and sequential implementations.
- On-chip Memory Approximately 2.14 Mbits of embedded RAM to support buffering, lookup tables, and other memory-intensive functions.
- I/O Resources 296 user I/O pins enable connectivity to multiple peripherals, buses, and external devices.
- Power Core voltage supply range of 1.14 V to 1.26 V for the device core.
- Package and Mounting 484-ball BGA package (supplier package: 484-FBGA, 23×23) in a surface-mount format for compact board-level integration.
- Operating Range Commercial-grade operation with an ambient temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for lead-free manufacturing requirements.
Unique Advantages
- High logic capacity: 43,661 logic elements support complex FPGA designs without immediate need for larger devices, reducing design fragmentation.
- Substantial embedded memory: Approximately 2.14 Mbits of on-chip RAM enables efficient data buffering and state storage inside the FPGA fabric.
- Extensive I/O count: 296 I/Os allow flexible interfacing to sensors, peripherals, and bus systems, simplifying board-level partitioning.
- Compact BGA footprint: 484-ball BGA (23×23) provides a dense, surface-mount package suitable for space-constrained PCBs.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching many consumer and industrial-adjacent deployments.
- Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements for modern electronics production.
Why Choose XC6SLX45T-2FGG484C?
The XC6SLX45T-2FGG484C balances substantial programmable logic, embedded memory, and extensive I/O in a compact 484-ball BGA package, making it well-suited for designers who need a mid-range FPGA resource set within commercial temperature bounds. Its defined core voltage range and surface-mount package facilitate integration into mainstream PCB assemblies.
This device is appropriate for teams and projects that require a reliable, RoHS-compliant FPGA platform with measurable logic and memory resources, enabling scalable designs and straightforward board-level implementation without speculation on unsupported attributes.
Request a quote or submit a procurement inquiry to receive pricing and availability for the XC6SLX45T-2FGG484C.

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