XC6SLX45T-3CSG324C

The XC6SLX45T-3CSG324C is a Spartan®-6 LXT field programmable gate array (FPGA) in a 324‑LFBGA (324‑CSPBGA 15×15) package designed for commercial applications. It integrates a substantial logic fabric and on-chip RAM to support high-density logic designs, interface bridging, and custom signal processing tasks.

With 43,661 logic elements, 3,411 CLB units, 190 I/O pins and approximately 2.14 Mbits of embedded memory, this device delivers a balanced mix of logic capacity, I/O bandwidth and embedded storage for mid-range FPGA designs while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity  43,661 logic elements and 3,411 CLB units provide a large programmable fabric for implementing complex digital logic and custom functions.
• Embedded Memory  Approximately 2.14 Mbits of on-chip RAM supports buffering, FIFOs and local storage for data-path and control logic.
• I/O Density  190 user I/O pins enable multiple parallel interfaces and flexible external connectivity for sensors, peripherals and high-speed links.
• Power Supply  Specified operating core voltage range of 1.14 V to 1.26 V for predictable power design and sequencing.
• Package and Mounting  324‑LFBGA (324‑CSPBGA, 15×15) in a surface-mount form factor offers a compact footprint for board-level deployment.
• Operational Range  Commercial grade device rated for 0 °C to 85 °C operating temperature suitable for standard commercial electronics environments.
• Environmental Compliance  RoHS compliant to meet lead-free assembly requirements.

Typical Applications

• Interface Bridging and Protocol Conversion  Use the device's I/O density and programmable logic to implement protocol translation and bridge functions between subsystems.
• Embedded Control and State Machines  Leverage the logic resources and on-chip RAM to implement deterministic control logic, sequencers and finite-state machines.
• Data Path Processing  Apply the combined logic and memory to buffer and process streaming data in mid-range signal-processing tasks.
• Prototyping and Custom IP Integration  Suitable for prototyping custom IP blocks and integrating multiple logic functions into a single programmable device.

Unique Advantages

• High Logic Density:  43,661 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Significant On‑Chip Memory:  Approximately 2.14 Mbits of embedded RAM supports local buffering and reduces dependence on external memory for many designs.
• Generous I/O Resources:  190 I/O pins provide flexibility for parallel interfaces and mixed-signal front-end integration.
• Compact Surface-Mount Package:  The 324‑CSPBGA (15×15) package balances board space efficiency with I/O count for dense system designs.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C to match standard commercial application requirements.
• RoHS Compliance:  Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose XC6SLX45T-3CSG324C?

The XC6SLX45T-3CSG324C provides a robust, mid-range FPGA option for commercial designs that need substantial logic capacity, embedded memory and flexible I/O in a compact BGA package. Its combination of 43,661 logic elements, approximately 2.14 Mbits of on-chip RAM and 190 I/Os makes it well suited for applications that require integration of multiple digital functions and local data buffering without resorting to larger device families.

This part is appropriate for engineers and teams building control logic, interface bridges, data-path processing or prototype platforms where predictable power requirements (1.14 V–1.26 V), surface-mount packaging and RoHS compliance are important considerations.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX45T-3CSG324C. Provide your quantity and delivery needs to get a tailored response.