XC6SLX45T-3FG484C

IC FPGA 296 I/O 484FBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 2138112 43661 484-BBGA

Quantity 756 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O296Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3411Number of Logic Elements/Cells43661
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2138112

Overview of XC6SLX45T-3FG484C – Spartan®-6 LXT FPGA, 484-BBGA

The XC6SLX45T-3FG484C is a Spartan®-6 LXT field programmable gate array provided in a 484-ball BGA package. It combines a substantial logic capacity, embedded RAM, and a high I/O count in a commercial-grade, surface-mount package suitable for a range of embedded designs.

This device targets designers who need mid-range programmable logic with on-chip memory and flexible I/O while operating within standard commercial temperature and low-voltage supply ranges.

Key Features

  • Logic Capacity  Provides 43,661 logic elements for implementing custom logic, state machines, and glue logic within a single FPGA.
  • Embedded Memory  Includes approximately 2.14 Mbits of on-chip RAM for buffering, packet storage, or small data structures without external memory.
  • I/O Resources  Offers 296 user I/O pins to support multiple peripheral interfaces and parallel bus connections within one device.
  • Power  Operates from a core voltage supply range of 1.14 V to 1.26 V, allowing integration with low-voltage systems.
  • Package & Mounting  Available in a 484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount assembly.
  • Operating Range  Commercial-grade device specified for 0 °C to 85 °C operation.
  • Regulatory  RoHS-compliant for lead-free manufacturing processes.

Unique Advantages

  • Substantial logic density: 43,661 logic elements enable consolidation of multiple functions into a single FPGA, reducing board complexity and part count.
  • On-chip memory: Approximately 2.14 Mbits of embedded RAM supports local buffering and small data structures without immediate external memory requirements.
  • High I/O count: 296 I/O pins allow flexible interfacing to sensors, peripherals, and parallel buses directly from the device.
  • Compact package: 484-BBGA (484-FBGA, 23×23) offers a high pin count in a compact footprint suitable for space-constrained PCBs.
  • Low-voltage operation: Narrow core voltage range (1.14 V–1.26 V) simplifies power-supply planning for low-voltage system designs.
  • RoHS compliance: Supports lead-free assembly and aligns with environmental manufacturing requirements.

Why Choose XC6SLX45T-3FG484C?

The XC6SLX45T-3FG484C balances logic capacity, embedded memory, and I/O density in a commercial-grade, surface-mount BGA package. Its configuration makes it suitable for embedded system designs that require mid-range programmable logic, on-chip RAM, and a high number of I/O signals while operating within standard commercial temperature and low-voltage supply constraints.

Designers benefit from consolidating multiple functions into a single FPGA to reduce BOM count, preserve PCB space, and maintain design flexibility. The device’s specification set supports scalable designs and straightforward integration into low-voltage, RoHS-compliant production environments.

Request a quote or submit a sales inquiry to get pricing and availability for the XC6SLX45T-3FG484C.

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