XC6SLX45T-3FG484C
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 2138112 43661 484-BBGA |
|---|---|
| Quantity | 756 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 296 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3411 | Number of Logic Elements/Cells | 43661 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2138112 |
Overview of XC6SLX45T-3FG484C – Spartan®-6 LXT FPGA, 484-BBGA
The XC6SLX45T-3FG484C is a Spartan®-6 LXT field programmable gate array provided in a 484-ball BGA package. It combines a substantial logic capacity, embedded RAM, and a high I/O count in a commercial-grade, surface-mount package suitable for a range of embedded designs.
This device targets designers who need mid-range programmable logic with on-chip memory and flexible I/O while operating within standard commercial temperature and low-voltage supply ranges.
Key Features
- Logic Capacity Provides 43,661 logic elements for implementing custom logic, state machines, and glue logic within a single FPGA.
- Embedded Memory Includes approximately 2.14 Mbits of on-chip RAM for buffering, packet storage, or small data structures without external memory.
- I/O Resources Offers 296 user I/O pins to support multiple peripheral interfaces and parallel bus connections within one device.
- Power Operates from a core voltage supply range of 1.14 V to 1.26 V, allowing integration with low-voltage systems.
- Package & Mounting Available in a 484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount assembly.
- Operating Range Commercial-grade device specified for 0 °C to 85 °C operation.
- Regulatory RoHS-compliant for lead-free manufacturing processes.
Unique Advantages
- Substantial logic density: 43,661 logic elements enable consolidation of multiple functions into a single FPGA, reducing board complexity and part count.
- On-chip memory: Approximately 2.14 Mbits of embedded RAM supports local buffering and small data structures without immediate external memory requirements.
- High I/O count: 296 I/O pins allow flexible interfacing to sensors, peripherals, and parallel buses directly from the device.
- Compact package: 484-BBGA (484-FBGA, 23×23) offers a high pin count in a compact footprint suitable for space-constrained PCBs.
- Low-voltage operation: Narrow core voltage range (1.14 V–1.26 V) simplifies power-supply planning for low-voltage system designs.
- RoHS compliance: Supports lead-free assembly and aligns with environmental manufacturing requirements.
Why Choose XC6SLX45T-3FG484C?
The XC6SLX45T-3FG484C balances logic capacity, embedded memory, and I/O density in a commercial-grade, surface-mount BGA package. Its configuration makes it suitable for embedded system designs that require mid-range programmable logic, on-chip RAM, and a high number of I/O signals while operating within standard commercial temperature and low-voltage supply constraints.
Designers benefit from consolidating multiple functions into a single FPGA to reduce BOM count, preserve PCB space, and maintain design flexibility. The device’s specification set supports scalable designs and straightforward integration into low-voltage, RoHS-compliant production environments.
Request a quote or submit a sales inquiry to get pricing and availability for the XC6SLX45T-3FG484C.

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