XC6SLX45T-4CSG324C

The XC6SLX45T-4CSG324C is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD. It integrates 43,661 logic elements, approximately 2.14 Mbits of embedded memory, and 190 user I/O pins in a 324‑LFBGA (324‑CSPBGA, 15×15) surface-mount package.

Designed for commercial-grade systems, this device operates from a 1.14 V to 1.26 V supply and across an operating temperature range of 0 °C to 85 °C, offering a compact, RoHS-compliant solution for designs that require moderate to high logic density and flexible I/O.

Key Features

• Core Architecture – Spartan®-6 LXT FPGA fabric in the Spartan‑6 LXT family provides programmable logic resources for custom digital functions.
• Logic Capacity 43,661 logic elements to implement complex combinational and sequential logic.
• Embedded Memory Approximately 2.14 Mbits of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O 190 user I/O pins to interface with peripherals, sensors, and external logic.
• Power Core supply voltage range of 1.14 V to 1.26 V for device operation.
• Package & Mounting 324‑LFBGA / 324‑CSPBGA (15×15) surface-mount package for compact board integration.
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and peripheral interfaces using 43,661 logic elements and 190 I/O in systems operating within a commercial temperature range.
• Interface Bridging and Glue Logic — Use the available I/O and on-chip RAM to translate, buffer, or aggregate signals between subsystems.
• Prototyping and Development — Leverage FPGA programmability and memory resources for rapid iteration of digital designs in surface-mount, compact packages.

Unique Advantages

• High Logic Density: 43,661 logic elements provide significant on-chip programmable resources for mid-scale digital designs.
• Integrated On-Chip Memory: Approximately 2.14 Mbits of embedded RAM reduces external memory dependency for buffering and control tasks.
• Generous I/O Count: 190 I/O pins accommodate multiple peripheral interfaces and signal domains without immediate external expansion.
• Compact Surface-Mount Package: 324‑LFBGA / 324‑CSPBGA (15×15) enables high-density PCB layouts while maintaining standard surface-mount assembly.
• Commercial Temperature Rating: Qualified for operation from 0 °C to 85 °C, suitable for a wide range of commercial products.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and distribution.

Why Choose XC6SLX45T-4CSG324C?

The XC6SLX45T-4CSG324C combines substantial programmable logic resources, embedded memory, and a high I/O count in a compact 324‑LFBGA surface-mount package, making it well suited for commercial designs that require flexible, on-board digital integration. Its 1.14 V–1.26 V supply range and 0 °C–85 °C operating range align with standard commercial deployment scenarios.

For teams balancing logic capacity, I/O connectivity, and form-factor constraints, this Spartan‑6 LXT FPGA from AMD delivers a verifiable, RoHS‑compliant building block that supports iterative development and scalable implementation within commercial product lines.

Request a quote or submit an inquiry to get pricing and availability for the XC6SLX45T-4CSG324C. Our team can assist with quantity pricing and lead-time information to support your project timeline.