XC6SLX45T-4CSG484C
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 2138112 43661 484-FBGA, CSPBGA |
|---|---|
| Quantity | 975 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CSPBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA, CSPBGA | Number of I/O | 296 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3411 | Number of Logic Elements/Cells | 43661 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2138112 |
Overview of XC6SLX45T-4CSG484C – Spartan®-6 LXT Field Programmable Gate Array (FPGA), 484-CSPBGA
The XC6SLX45T-4CSG484C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) delivered in a 484-ball CSPBGA package. It provides a well-balanced mix of programmable logic, on-chip memory and I/O to support custom digital designs that require moderate logic capacity and dense pin count.
Key architectural attributes include 43,661 logic elements, approximately 2.14 Mbits of embedded memory, and up to 296 user I/Os, all in a compact 484-CSPBGA (19×19) surface-mount package suitable for commercial temperature operation.
Key Features
- Programmable Logic — 43,661 logic elements for implementing custom digital functions, state machines and glue logic.
- Embedded Memory — Approximately 2.14 Mbits of total on-chip RAM (2,138,112 bits) for buffering, FIFOs and small data stores.
- I/O Capacity — Up to 296 general-purpose I/Os to connect with peripherals, interfaces and external devices.
- Package and Mounting — 484-CSPBGA (19×19) / 484-FBGA package designed for surface-mount assembly to minimize PCB footprint.
- Power — Core supply voltage range of 1.14 V to 1.26 V to match system power rails and regulator designs.
- Operating Range — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Custom digital logic — Implement application-specific processing, protocol conversion, and glue logic using 43,661 logic elements and embedded RAM.
- High-density I/O interfacing — Support multiple peripheral connections and parallel interfaces with up to 296 available I/Os in a compact package.
- Data buffering and timing control — Use on-chip RAM (approximately 2.14 Mbits) for small buffering, FIFOs and timing-sensitive logic.
Unique Advantages
- Significant logic capacity: 43,661 logic elements enable complex finite-state machines, datapaths and custom accelerators without immediate need for external logic.
- On-chip memory resource: Approximately 2.14 Mbits of embedded RAM reduces dependency on external memory for moderate buffering and storage needs.
- High I/O count in a small footprint: 296 I/Os in a 484-CSPBGA (19×19) package provides dense connectivity while conserving PCB area.
- Surface-mount package: The 484-CSPBGA format supports automated assembly processes for volume production.
- Controlled core voltage: A defined core supply range of 1.14 V to 1.26 V aids predictable power supply design and integration.
- Commercial-grade operation: Rated for 0 °C to 85 °C and RoHS compliant for mainstream electronic applications.
Why Choose XC6SLX45T-4CSG484C?
The XC6SLX45T-4CSG484C positions itself as a capable mid-range FPGA solution that balances logic capacity, embedded memory and I/O density in a compact CSPBGA footprint. Its feature set is suitable for designs that require substantial programmable logic (43,661 logic elements), meaningful on-chip RAM (approximately 2.14 Mbits) and nearly 300 I/Os without moving to larger packages.
This device is well suited for development and production systems that operate within commercial temperature limits and require RoHS-compliant components. It offers a straightforward integration path where package density, I/O count and defined power rails are important selection criteria.
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