XC6SLX45T-4FGG484C
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 2138112 43661 484-BBGA |
|---|---|
| Quantity | 1,183 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 296 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3411 | Number of Logic Elements/Cells | 43661 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2138112 |
Overview of XC6SLX45T-4FGG484C – Spartan®-6 LXT Field Programmable Gate Array (484-BBGA)
The XC6SLX45T-4FGG484C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) from AMD designed for commercial electronic designs requiring programmable digital logic. This surface-mount FPGA combines a high count of logic elements, embedded on-chip memory, and a large I/O complement in a compact 484-ball BGA package.
Its specification set—including a 1.14 V to 1.26 V supply range, commercial operating temperature range, and RoHS compliance—makes it suitable for a broad range of commercial embedded applications where density and integration are key.
Key Features
- Logic Density Approximately 43,661 logic elements to implement complex custom logic and control functions.
- Embedded Memory Approximately 2.14 Mbits of on-chip RAM for buffering, storage, and state retention within designs.
- I/O Capacity 296 I/O pins to support extensive peripheral interfacing and parallel signal routing.
- Package & Mounting 484-ball BGA (supplier device package: 484-FBGA, 23×23) in a surface-mount footprint for high-density PCB implementations.
- Power Supported core supply voltage range of 1.14 V to 1.26 V to match system power domains.
- Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for regulatory and environmental considerations.
- Manufacturer Produced by AMD, identified by part number XC6SLX45T-4FGG484C.
Typical Applications
- Custom Digital Logic Implement state machines, data processing pipelines, and application-specific accelerators using the device’s logic resources and on-chip memory.
- High-Density I/O Interfacing Connect multiple peripherals, buses, or parallel interfaces leveraging the device’s 296 I/O pins.
- Embedded System Integration Integrate control and glue-logic functions for commercial embedded products where compact packaging and surface-mount assembly are required.
- Prototyping and Development Use the FPGA’s programmable fabric and memory to iterate hardware designs and validate digital architectures in commercial projects.
Unique Advantages
- High Logic Capacity: Approximately 43,661 logic elements provide room to implement sizeable custom logic blocks without external CPLDs.
- On-Chip Memory: Around 2.14 Mbits of embedded RAM reduces the need for additional external memory in many buffer and state-storage use cases.
- Extensive I/O: 296 I/O pins enable flexible interfacing to sensors, controllers, and high-pin-count peripherals.
- Compact BGA Package: The 484-ball BGA (484-FBGA, 23×23) package supports high-density PCB layouts while remaining surface-mount compatible.
- Controlled Power Range: A defined core voltage range (1.14 V to 1.26 V) aids in predictable power budgeting and system integration.
- Commercial Grade & RoHS Compliant: Designed for commercial environments and meets RoHS requirements for materials compliance.
Why Choose XC6SLX45T-4FGG484C?
The XC6SLX45T-4FGG484C positions itself as a compact, high-density FPGA option for commercial embedded designs that need substantial logic resources, on-chip memory, and broad I/O capability in a surface-mount BGA footprint. Its specification set supports integration into systems where circuit density, configurable logic, and component-level compliance are priorities.
This part is appropriate for design teams and procurement focused on scalable programmable logic solutions with clear, verifiable specifications—offering predictable operating parameters, environmental compliance, and the flexibility of FPGA-based implementation from a recognized manufacturer.
Request a quote or submit your procurement inquiry to receive pricing and availability for the XC6SLX45T-4FGG484C from our team.

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Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








