XC6SLX45T-N3CSG324C

The XC6SLX45T-N3CSG324C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD housed in a 324-LFBGA / 324-CSPBGA (15×15) package. It provides a balance of programmable logic capacity, on-chip memory, and I/O density targeted at commercial applications that require customizable digital logic and moderate I/O connectivity.

Key Features

• Core logic — 3,411 CLBs supporting 43,661 logic elements for implementing custom digital functions and finite-state logic.
• Embedded memory — Approximately 2.14 Mbits of on-chip RAM (2,138,112 total RAM bits) for buffering, lookup tables, and local storage.
• I/O capacity — 190 user I/O pins to support multiple interfaces and peripheral connections.
• Power supply — Operates from a supply range of 1.14 V to 1.26 V, enabling stable core power management.
• Package and mounting — Available in a 324-LFBGA / 324-CSPBGA (15×15) package designed for surface-mount assembly.
• Operating range and grade — Commercial grade with an operating temperature range of 0°C to 85°C.
• Regulatory compliance — RoHS compliant for lead-free assembly and environmental standards.

Typical Applications

• Commercial embedded systems — Implement custom logic, glue-logic, and peripheral control in compact commercial devices using available CLBs and I/O.
• Communications equipment — Provide programmable data-paths and protocol handling leveraging on-chip memory and moderate I/O counts.
• Consumer electronics — Integrate customizable control and interface logic in consumer products where commercial temperature range and package density are suitable.
• Prototyping and development — Use the Spartan-6 LXT device for design iteration and proof-of-concept projects requiring reprogrammable logic and embedded RAM.

Unique Advantages

• Well-sized logic capacity: 43,661 logic elements and 3,411 CLBs provide room to implement mid-scale digital designs without overprovisioning.
• On-chip memory for local buffering: Approximately 2.14 Mbits of embedded RAM supports data buffering and local storage close to logic.
• Broad I/O availability: 190 user I/O pins enable multiple peripheral and interface connections within a single device.
• Compact, surface-mount package: 324-LFBGA / 324-CSPBGA (15×15) packaging supports dense board layouts and automated assembly.
• Commercial temperature and RoHS compliance: Rated for 0°C to 85°C and RoHS compliant for mainstream commercial deployments.
• Predictable power envelope: Narrow core supply range (1.14 V to 1.26 V) simplifies power supply design for the FPGA core.

Why Choose XC6SLX45T-N3CSG324C?

The XC6SLX45T-N3CSG324C offers a balanced combination of logic capacity, embedded memory, and I/O density in a compact surface-mount BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of mainstream electronic products that require programmable logic integration.

Designed for developers and procurement teams seeking a mid-range Spartan®-6 LXT device from AMD, this FPGA supports scalable designs where on-chip RAM and moderate I/O counts are important. The device’s package options and clear electrical and thermal specs simplify BOM planning and board-level integration.

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