XC6SLX45T-N3FGG484C

The XC6SLX45T-N3FGG484C is a Spartan®-6 LXT field programmable gate array delivered in a 484-ball BGA package. It provides a combination of on-chip logic capacity, embedded RAM, and high I/O count suitable for designs that require programmable digital logic and substantial local memory.

Architected for surface-mount integration and commercial-temperature operation, this FPGA is positioned for applications where logic density, I/O count, and controlled supply voltage are key design considerations.

Key Features

• Logic Capacity  Approximately 43,661 logic elements enabling a broad range of custom digital functions and moderate-scale logic integration.
• Configurable Logic Blocks (CLBs)  3,411 CLBs to organize and implement distributed logic structures across the device.
• Embedded Memory  Approximately 2.14 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• I/O Density  296 I/O pins to accommodate multiple interfaces, signal routing and connectivity needs in compact designs.
• Power  Nominal core supply range of 1.14 V to 1.26 V for the FPGA core supply domain.
• Package & Mounting  484-ball BGA (supplier package: 484-FBGA, 23 × 23) in a surface-mount form factor for board-level assembly.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard industrial/commercial environments.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Custom Digital Logic  Implement application-specific logic functions and finite-state machines using the device's sizable logic element count and CLB resources.
• On-Chip Memory Support  Use the approximately 2.14 Mbits of embedded RAM for buffering, data staging, and lookup-table storage without relying solely on external memory.
• I/O-Intensive Interfaces  Leverage 296 I/O pins to connect multiple peripherals, sensors, or parallel interfaces in compact board designs.

Unique Advantages

• Substantial Logic Density:  Approximately 43,661 logic elements provide the resources to consolidate multiple functions into a single FPGA, reducing component count.
• On-Chip Memory:  Around 2.14 Mbits of embedded RAM lowers dependence on external memory and can improve data-path latency and throughput.
• High I/O Count:  296 I/O positions enable flexible interfacing options for varied digital and parallel connections.
• Compact BGA Package:  484-ball BGA in a 23 × 23 footprint supports dense PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial Temperature Grade:  Rated for 0 °C to 85 °C operation to suit a wide range of standard commercial applications.
• RoHS Compliance:  Supports lead-free manufacturing and environmental regulatory requirements.

Why Choose XC6SLX45T-N3FGG484C?

The XC6SLX45T-N3FGG484C offers a balanced combination of logic resources, embedded RAM, and I/O density in a surface-mount 484-BBGA package, making it suitable for designs that require consolidated programmable logic and on-chip memory. Its defined core voltage range and commercial temperature rating provide clear design parameters for board- and system-level integration.

This part is well matched to engineering teams looking to implement medium-scale custom digital functions, accommodate multiple interfaces, and reduce external component count while maintaining RoHS-compliant assembly practices.

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