XC6SLX75-2FG484C
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 280 3170304 74637 484-BBGA |
|---|---|
| Quantity | 690 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 280 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5831 | Number of Logic Elements/Cells | 74637 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3170304 |
Overview of XC6SLX75-2FG484C – Spartan®-6 LX FPGA, 484-BBGA
The XC6SLX75-2FG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, provided in a 484-ball BGA package. This commercial-grade device offers a combination of configurable logic, embedded memory and a substantial I/O count for general-purpose FPGA integration.
With 5,831 configurable logic blocks and 74,637 logic elements plus approximately 3.17 Mbits of on-chip RAM, the device is suited to designs that require significant programmable logic and embedded memory within a compact surface-mount BGA package.
Key Features
- Core Logic 5,831 configurable logic blocks (CLBs) providing a total of 74,637 logic elements for implementing custom digital functions.
- Embedded Memory Approximately 3.17 Mbits of on-chip RAM available for data buffering, FIFOs and local storage.
- I/O Capacity 280 user I/O pins to accommodate multiple peripheral interfaces and board-level connectivity.
- Power Core supply operating range of 1.14 V to 1.26 V, enabling defined power design and supply selection.
- Package & Mounting 484-ball BGA (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor for dense board integration.
- Operating Range Commercial operating temperature from 0 °C to 85 °C; grade: Commercial.
- Compliance RoHS compliant to support regulatory and assembly requirements.
Unique Advantages
- Substantial Logic Capacity: 74,637 logic elements and 5,831 CLBs provide the programmable resources needed for complex control and signal-processing functions.
- Embedded Memory On-Die: Approximately 3.17 Mbits of RAM reduces the need for external memory in many buffering and storage applications.
- High I/O Count: 280 I/O pins enable connectivity to multiple peripherals and interfaces without excessive external multiplexing.
- Compact BGA Packaging: 484-BBGA (484-FBGA, 23×23) delivers a dense, surface-mount solution that conserves PCB area while supporting high pin counts.
- Defined Power Envelope: A clear core voltage range (1.14–1.26 V) simplifies power supply selection and system-level power planning.
- Commercial Grade Certification: Specified operating range of 0 °C to 85 °C aligns with commercial product requirements and deployments.
Why Choose XC6SLX75-2FG484C?
The XC6SLX75-2FG484C positions itself as a versatile commercial-grade FPGA option that combines significant programmable logic, on-chip memory and a large I/O count within a compact 484-ball BGA package. Its characteristics make it suitable for designs that require a balance of integration and board-area efficiency.
Engineers and procurement teams can rely on the clear electrical and thermal specifications—core voltage range, operating temperature, package type and RoHS compliance—to assess system compatibility and long-term supply considerations.
Request a quote or submit a purchase inquiry to receive pricing and availability for the XC6SLX75-2FG484C.

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