XC6SLX75-2FG484C

IC FPGA 280 I/O 484FBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 280 3170304 74637 484-BBGA

Quantity 690 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O280Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5831Number of Logic Elements/Cells74637
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3170304

Overview of XC6SLX75-2FG484C – Spartan®-6 LX FPGA, 484-BBGA

The XC6SLX75-2FG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, provided in a 484-ball BGA package. This commercial-grade device offers a combination of configurable logic, embedded memory and a substantial I/O count for general-purpose FPGA integration.

With 5,831 configurable logic blocks and 74,637 logic elements plus approximately 3.17 Mbits of on-chip RAM, the device is suited to designs that require significant programmable logic and embedded memory within a compact surface-mount BGA package.

Key Features

  • Core Logic  5,831 configurable logic blocks (CLBs) providing a total of 74,637 logic elements for implementing custom digital functions.
  • Embedded Memory  Approximately 3.17 Mbits of on-chip RAM available for data buffering, FIFOs and local storage.
  • I/O Capacity  280 user I/O pins to accommodate multiple peripheral interfaces and board-level connectivity.
  • Power  Core supply operating range of 1.14 V to 1.26 V, enabling defined power design and supply selection.
  • Package & Mounting  484-ball BGA (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor for dense board integration.
  • Operating Range  Commercial operating temperature from 0 °C to 85 °C; grade: Commercial.
  • Compliance  RoHS compliant to support regulatory and assembly requirements.

Unique Advantages

  • Substantial Logic Capacity: 74,637 logic elements and 5,831 CLBs provide the programmable resources needed for complex control and signal-processing functions.
  • Embedded Memory On-Die: Approximately 3.17 Mbits of RAM reduces the need for external memory in many buffering and storage applications.
  • High I/O Count: 280 I/O pins enable connectivity to multiple peripherals and interfaces without excessive external multiplexing.
  • Compact BGA Packaging: 484-BBGA (484-FBGA, 23×23) delivers a dense, surface-mount solution that conserves PCB area while supporting high pin counts.
  • Defined Power Envelope: A clear core voltage range (1.14–1.26 V) simplifies power supply selection and system-level power planning.
  • Commercial Grade Certification: Specified operating range of 0 °C to 85 °C aligns with commercial product requirements and deployments.

Why Choose XC6SLX75-2FG484C?

The XC6SLX75-2FG484C positions itself as a versatile commercial-grade FPGA option that combines significant programmable logic, on-chip memory and a large I/O count within a compact 484-ball BGA package. Its characteristics make it suitable for designs that require a balance of integration and board-area efficiency.

Engineers and procurement teams can rely on the clear electrical and thermal specifications—core voltage range, operating temperature, package type and RoHS compliance—to assess system compatibility and long-term supply considerations.

Request a quote or submit a purchase inquiry to receive pricing and availability for the XC6SLX75-2FG484C.

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