XC6SLX75-2FGG484I

IC FPGA 280 I/O 484FBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 280 3170304 74637 484-BBGA

Quantity 376 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O280Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5831Number of Logic Elements/Cells74637
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3170304

Overview of XC6SLX75-2FGG484I – Spartan®-6 LX Field Programmable Gate Array (FPGA) IC

The XC6SLX75-2FGG484I is an industrial-grade Spartan®-6 LX Field Programmable Gate Array from AMD. This surface-mount FPGA combines programmable logic resources, on-chip embedded memory, and flexible I/O in a 484-ball BGA package targeted at industrial applications requiring reliable programmable logic.

Key on-chip resources include 74,637 logic elements and approximately 3.17 Mbits of embedded memory, with 280 I/O and a supply voltage range of 1.14 V to 1.26 V. The device is specified for operation from -40 °C to 100 °C, enabling deployment in temperature-challenging environments.

Key Features

  • Logic Capacity 74,637 logic elements for implementing complex programmable logic and custom digital functions.
  • Embedded Memory Approximately 3.17 Mbits of on-chip RAM to support buffering, state storage, and data manipulation without external memory.
  • I/O Resources 280 user I/O pins to interface with peripherals, sensors, and external subsystems.
  • Package and Mounting 484-ball BGA package (484-BBGA) with supplier device package listed as 484-FBGA (23×23); designed for surface-mount assembly.
  • Power Operates from a core supply voltage range of 1.14 V to 1.26 V to match system power rails.
  • Industrial Temperature Range Rated for operation from -40 °C to 100 °C for use in industrial environments.
  • Compliance RoHS compliant, meeting common environmental substance requirements.

Typical Applications

  • Industrial Automation — Implements control logic, interfaces to sensors and actuators, and custom processing within industrial control systems using its industrial temperature rating and ample logic resources.
  • Embedded Systems — Provides programmable digital logic and on-chip memory for embedded designs requiring flexible I/O and moderate embedded RAM capacity.
  • Communication Interfaces — Enables protocol adaptation and interfacing with external devices through its 280 I/O pins and programmable logic fabric.

Unique Advantages

  • High Logic Density: 74,637 logic elements enable implementation of sizable custom logic functions and moderate-scale designs without external accelerators.
  • On-Chip Memory: Approximately 3.17 Mbits of embedded RAM reduces the need for external memory for many buffering and state storage tasks.
  • Generous I/O Count: 280 I/O pins support extensive peripheral and subsystem interconnection, simplifying board-level integration.
  • Industrial Rating: Specified operation from -40 °C to 100 °C supports deployment in industrial environments with wide temperature swings.
  • Compact Surface-Mount BGA: 484-ball BGA (23×23) package balances board space and thermal/mechanical robustness for surface-mount assembly.
  • Low-Voltage Core: Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage system designs.

Why Choose XC6SLX75-2FGG484I?

The XC6SLX75-2FGG484I positions itself as an industrial-grade Spartan®-6 LX FPGA that combines substantial logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its specified operating temperature range and RoHS compliance make it suitable for industrial applications that require dependable programmable logic with onboard RAM and extensive interfacing options.

This device is appropriate for engineers and procurement teams designing industrial controllers, embedded processing modules, and communication interfaces that need moderate to large programmable logic resources with on-chip memory and robust thermal tolerance.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XC6SLX75-2FGG484I. Technical and purchasing support can provide details to help integrate this FPGA into your design.

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