XC6SLX75-3CSG484I

The XC6SLX75-3CSG484I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, provided in a 484‑FBGA (CSPBGA) package. It delivers programmable logic, on-chip embedded memory, and a high I/O count in an industrial-grade device designed for board-level integration.

This device targets applications that require a balance of logic capacity, memory, and I/O density while operating over an industrial temperature range and a well-defined core voltage window.

Key Features

• Core Architecture  Spartan®-6 LX family FPGA architecture provided by AMD for programmable logic implementation.
• Logic Capacity  74,637 logic elements enabling complex logic, control, and glue-logic designs.
• Configurable Logic Blocks (CLBs)  5,831 CLBs for structured logic partitioning and design organization.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM to support buffers, FIFOs, and distributed storage.
• I/O Resources  328 user I/Os to interface with peripherals, sensors, and external devices.
• Package & Mounting  484‑FBGA (19 × 19 CSPBGA) surface-mount package suitable for compact, high-density PCB layouts.
• Power Requirements  Core supply voltage range of 1.14 V to 1.26 V for defined power provisioning and regulator selection.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C to support deployable systems in demanding environments.
• Regulatory Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Use the device for control logic, I/O aggregation, and protocol bridging in industrial systems that require an extended temperature range.
• Embedded and Board-Level Systems  Implement custom logic, peripheral interfaces, and timing-critical functions where integrated memory and high I/O count are needed.
• Communications and Networking  Apply the FPGA for packet handling, interface conversion, and custom data-path implementations leveraging its logic and memory resources.
• Instrumentation and Test Equipment  Deploy the device for signal conditioning, real-time control, and data buffering in measurement systems.

Unique Advantages

• Substantial Logic Density: 74,637 logic elements provide headroom for complex finite state machines, control logic, and glue logic without immediate migration.
• On-Chip Memory: Approximately 3.17 Mbits of embedded RAM reduces the need for external memory in many buffering and small-data storage scenarios.
• High I/O Count: 328 user I/Os enable broad interfacing options to sensors, ADCs/DACs, transceivers, and peripheral devices.
• Industrial Temperature Support: Rated from −40 °C to 100 °C for reliable operation in a wide range of environmental conditions.
• Compact, High-Density Package: The 484‑FBGA (19×19 CSPBGA) surface-mount package supports dense PCB integration for space-constrained designs.
• Defined Core Voltage Window: 1.14 V to 1.26 V supply range simplifies selection of core power regulation components.

Why Choose XC6SLX75-3CSG484I?

The XC6SLX75-3CSG484I combines a substantial logic element count, embedded RAM, and a large number of user I/Os in an industrial-grade Spartan®-6 LX FPGA package from AMD. Its 484‑FBGA surface-mount form factor and defined core voltage range make it suitable for compact, board-level designs that demand predictable power and thermal characteristics.

This part is well suited for engineers developing industrial control, embedded processing, communications, or instrumentation solutions that require programmable logic coupled with on-chip memory and robust operating-temperature support. The specification set supports designs that prioritize integration density and determinable electrical and environmental limits.

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