XC6SLX75-3FG484I

The XC6SLX75-3FG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) offered in a 484-ball BGA package for surface-mount assembly. It provides a balanced combination of programmable logic resources, embedded memory, and I/O density suitable for industrial applications.

Designed for use in systems that require flexible hardware acceleration, interface bridging, or custom digital logic, this device delivers a clear mix of integration, I/O count, and operating range to support ruggedized designs.

Key Features

• Logic Resources — Provides 74,637 logic elements to implement custom digital functions and state machines.
• Configurable Logic Blocks — Structured to support sizable designs with 5,831 configurable logic block units.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM for data buffering, FIFOs, and small on-chip storage.
• I/O Density — 280 user I/O pins to support multiple parallel interfaces and mixed-signal front ends.
• Power — Core supply operating range from 1.14 V to 1.26 V to match system power rails and regulator designs.
• Package & Mounting — 484-ball BGA (484-FBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement motor control logic, custom timing, and protocol adaptation within the industrial temperature range.
• Communications Interfaces — Bridge or aggregate multiple serial and parallel interfaces using abundant I/O and on-chip memory for buffering.
• Embedded Acceleration — Offload compute-bound tasks or implement hardware accelerators where deterministic timing and reconfigurability are required.
• Prototyping & Custom Logic — Rapidly develop and iterate custom digital functions and verify system-level integration before production.

Unique Advantages

• Substantial Logic Capacity: 74,637 logic elements allow complex designs to be realized on a single device, reducing the need for multiple FPGAs.
• Integrated Memory for Buffers: Approximately 3.17 Mbits of embedded RAM supports on-chip buffering and small data stores, simplifying board-level memory requirements.
• High I/O Count: 280 user I/Os enable direct connection to multiple peripherals and interfaces, minimizing external multiplexing components.
• Industrial Grade Operation: Specified for −40 °C to 100 °C operation to support deployment in demanding environments.
• Compact BGA Package: 484-ball FBGA (23×23) in a surface-mount footprint provides a high-pin-density solution for space-constrained PCBs.
• Standards-Friendly Compliance: RoHS compliance simplifies regulatory considerations for modern electronic assemblies.

Why Choose XC6SLX75-3FG484I?

The XC6SLX75-3FG484I positions itself as a flexible, industrial-grade FPGA offering a strong balance of logic capacity, embedded memory, and I/O resources in a compact BGA package. Its specified operating range and RoHS status make it appropriate for engineers designing industrial systems that require reconfigurable hardware and reliable operation across temperature extremes.

This device is well suited for development teams and production engineers seeking a single-chip solution for interface consolidation, hardware acceleration, or custom digital logic with moderate on-chip memory and substantial I/O counts. Its core voltage range and package choices simplify integration with existing power and board designs.

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