XC6SLX75-3CSG484C

The XC6SLX75-3CSG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, offered in a 484-ball CSPBGA package. It provides a balance of programmable logic capacity, on-chip embedded memory, and high I/O count for commercial-grade embedded designs.

Built for surface-mount assembly and commercial temperature operation, this device suits applications that need moderate logic density, substantial embedded RAM, and a compact high-pin-count package.

Key Features

• Core Logic — 5,831 logic cell blocks delivering 74,637 logic elements for implementing custom digital functions and control logic.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM to support buffering, FIFOs, and small data storage without external memory.
• High I/O Count — 328 general-purpose I/O pins for broad peripheral and bus connectivity in complex designs.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting — 484-FBGA, CSPBGA (19×19) surface-mount package that enables compact, board-level integration.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature, suitable for commercial deployments.
• Regulatory — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement custom control, protocol bridging, or glue-logic for compact commercial devices operating within 0 °C to 85 °C.
• I/O-Intensive Interfaces — Use the 328 I/O pins for dense peripheral connectivity, multi-channel interfacing, or board-level signal aggregation.
• On-Chip Buffering and Data Paths — Leverage approximately 3.17 Mbits of embedded RAM for buffering, FIFOs, and small data-store tasks without immediate need for external memory.

Unique Advantages

• High Logic Density: 74,637 logic elements enable implementation of sizable custom logic functions while maintaining a compact footprint.
• Integrated Memory: Approximately 3.17 Mbits of on-chip RAM reduces dependence on external memory for many embedded buffering needs.
• Extensive I/O: 328 I/O pins support multiple interfaces or parallel connectivity, simplifying board-level integration.
• Compact, Surface-Mount Package: The 484-CSPBGA (19×19) package supports dense PCB designs where board area is limited.
• Commercial-Grade Operation: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial production environments.

Why Choose XC6SLX75-3CSG484C?

The XC6SLX75-3CSG484C positions itself as a commercial-grade Spartan®-6 LX FPGA that balances sizable programmable logic, embedded RAM, and a high I/O count in a compact 484-ball CSPBGA package. It is suited to engineers and procurement teams looking for a surface-mount FPGA solution for commercial embedded applications where on-chip memory and abundant I/O simplify board-level design.

With a defined core voltage range and standard commercial temperature rating, this device offers predictable integration characteristics for mid-density programmable logic tasks and I/O-centric designs.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX75-3CSG484C.