XC6SLX75-3FG676I

The XC6SLX75-3FG676I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) in a 676-ball BGA package designed for surface-mount applications. It provides a programmable logic fabric with substantial I/O density, embedded memory, and an industrial operating temperature range for deployments that require flexible digital logic and reliable operation across a wide temperature span.

Key Features

• Logic Fabric 74,637 logic elements providing capacity for complex combinational and sequential logic implementations; includes 5,831 CLBs to structure the programmable logic.
• Embedded Memory Approximately 3.17 Mbits of on-chip RAM to support buffers, FIFOs, and small data stores inside the FPGA fabric.
• I/O Capacity 408 user I/O pins to support multiple interfaces, parallel buses, and mixed-signal connectivity on a single device.
• Package and Mounting 676-ball BGA (supplier package: 676-FBGA, 27×27) in a surface-mount format for compact board-level integration.
• Supply Voltage Core supply range of 1.14 V to 1.26 V to match system power rails and design requirements.
• Temperature Grade Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliant Manufactured to meet RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Custom Digital Logic Implement application-specific datapaths, state machines, and timing-critical control logic using the programmable fabric and abundant logic elements.
• Interface Bridging Use the device’s high I/O count to consolidate multiple interface standards and protocol conversion on a single FPGA.
• Embedded Memory Functions Leverage approximately 3.17 Mbits of on-chip RAM for buffering, packet handling, and small-scale data storage close to logic.

Unique Advantages

• High Logic Density: 74,637 logic elements enable substantial on-chip logic integration, reducing the need for external glue logic.
• Generous I/O Count: 408 I/O pins allow consolidation of multiple signals and interfaces, simplifying board-level routing and component count.
• Compact BGA Package: 676-FBGA (27×27) provides a high-pin-count solution in a compact footprint suitable for space-constrained designs.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support reliable operation in harsh or outdoor environments.
• On-Chip Memory: Approximately 3.17 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
• RoHS Compliant: Meets RoHS environmental requirements for lead-free manufacturing and end-product compliance.

Why Choose XC6SLX75-3FG676I?

The XC6SLX75-3FG676I delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 676-ball BGA package, making it suitable for designs that require versatile programmable logic with industrial temperature performance. Its core voltage range and surface-mount package support integration into modern PCB assemblies while the RoHS compliance supports environmentally conscious manufacturing.

Ideal for engineers and procurement teams seeking a dependable Spartan®-6 LX FPGA with substantial on-chip resources and robust thermal range, this device supports scalable designs where board-level consolidation and reliable operation across temperature extremes matter.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XC6SLX75-3FG676I.