XC6SLX75-3FGG676C

The XC6SLX75-3FGG676C is a Spartan®-6 LX Field Programmable Gate Array from AMD. It provides a balanced combination of programmable logic, on-chip memory, and I/O in a compact 676‑BGA surface-mount package.

With approximately 74,637 logic elements, around 3.17 Mbits of embedded RAM, and 408 user I/O pins, this commercial-grade device targets designs that require moderate logic density, significant on-chip storage, and ample external interfacing while operating within a 0 °C to 85 °C range and a core voltage supply of 1.14 V to 1.26 V.

Key Features

• Programmable Logic Capacity  Approximately 74,637 logic elements for implementing complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM to support buffering, state machines, and local data storage without immediate dependence on external memory.
• Rich I/O Resources  408 user I/O pins to connect sensors, peripherals, and external devices with flexible pin availability.
• Package and Mounting  676‑FBGA (27×27) package case in a surface-mount form factor for compact PCB layouts.
• Power Supply  Core voltage supply range of 1.14 V to 1.26 V for defined power planning at the FPGA core.
• Operating Conditions and Grade  Commercial grade device rated for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.

Typical Applications

• Custom Digital Systems  Implement complex, application-specific logic using the device’s ~74,637 logic elements to consolidate multiple functions into a single FPGA.
• High‑I/O Control  Leverage 408 user I/O pins to manage multi-channel interfaces, parallel peripheral connections, or dense signal routing.
• On‑chip Memory‑centric Designs  Use approximately 3.17 Mbits of embedded RAM for local buffering, small data tables, and state storage to reduce reliance on external memory.

Unique Advantages

• Substantial Logic Density:  Approximately 74,637 logic elements enable integration of multiple subsystems and support for moderately complex designs.
• Embedded RAM Reduces BOM:  Around 3.17 Mbits of on-chip memory can reduce the need for external RAM components in many designs.
• High I/O Count:  408 user I/O pins simplify direct interfacing to a wide variety of peripherals and signal sources.
• Compact BGA Footprint:  676‑FBGA (27×27) surface-mount package supports high-density PCB layouts and space-constrained applications.
• Defined Core Voltage Range:  1.14 V to 1.26 V core supply simplifies power-supply selection and design constraints for the FPGA core.
• Commercial Temperature and RoHS Compliance:  Rated for 0 °C to 85 °C operation and RoHS compliant for regulatory and environmental considerations.

Why Choose XC6SLX75-3FGG676C?

The XC6SLX75-3FGG676C offers a well-rounded feature set for designers needing significant programmable logic, substantial on-chip RAM, and high I/O counts in a compact BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of non-automotive, commercially oriented electronic designs.

As part of the Spartan®-6 LX family from AMD, this device is positioned for teams seeking moderate logic density and embedded memory in a surface-mount 676‑BGA form factor—providing scalability for designs that consolidate multiple functions into a single FPGA-based solution.

Request a quote or contact sales to discuss availability and pricing for the XC6SLX75-3FGG676C.