XC6SLX75-3FGG484I

The XC6SLX75-3FGG484I is a Spartan®-6 LX field programmable gate array (FPGA) provided in a 484-ball BGA package. It delivers a balanced combination of logic capacity, embedded memory, and I/O density for industrial applications that require programmable logic in a compact surface-mount package.

With industrial-grade temperature range and a defined core supply window, this device is suitable for designs that need verified operating limits and a solid set of on-chip resources for control, signal processing, and interface consolidation.

Key Features

• Logic Capacity — Provides 74,637 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Resources — 280 general-purpose I/O pins to interface with sensors, peripherals, and external devices.
• Package and Mounting — Supplied in a 484-ball BGA (484-BBGA / supplier package: 484-FBGA, 23×23), designed for surface-mount assembly.
• Power Supply — Core voltage supply range of 1.14 V to 1.26 V to match system power domains.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Environmental Compliance — RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control — Industrial-grade temperature rating and on-chip resources enable implementation of control logic and real-time processing in factory automation equipment.
• Signal Processing — High logic element count and embedded RAM support buffering and custom signal conditioning functions.
• Interface Aggregation — Large number of I/O pins allows consolidation of multiple peripheral and sensor interfaces into a single programmable device.

Unique Advantages

• High Logic Integration: 74,637 logic elements provide capacity for substantial custom logic without external ASICs.
• On-Chip Memory: Approximately 3.17 Mbits of embedded RAM reduces dependence on external memory for many designs, simplifying PCB layout.
• Broad I/O Count: 280 I/O pins enable direct connection to multiple peripherals and sensors, reducing the need for additional interface components.
• Industrial Reliability: Rated operation from −40 °C to 100 °C ensures suitability for demanding temperature environments.
• Compact Surface-Mount Package: 484-BBGA (484-FBGA, 23×23) provides a high-density solution for space-constrained boards.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and deployment.

Why Choose XC6SLX75-3FGG484I?

The XC6SLX75-3FGG484I positions itself as a practical FPGA option for industrial designs that need a combination of sizable logic capacity, embedded memory, and significant I/O in a surface-mount BGA form factor. Its specified core voltage range and industrial temperature rating make it well suited to systems where operating limits and predictable behavior are important.

Engineers and procurement teams can rely on this device for applications that demand programmable flexibility, on-board memory resources, and robust I/O support while maintaining compliance with RoHS requirements.

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