XC6SLX75-3FGG484C

The XC6SLX75-3FGG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 484-ball BGA surface-mount package. It provides a programmable logic platform with substantial logic capacity, on-chip memory, and a high count of user I/Os for a range of commercial embedded applications.

Key specifications include 74,637 logic elements, approximately 3.17 Mbits of embedded memory, 280 user I/Os, a core supply range of 1.14 V to 1.26 V, and commercial operating temperature from 0°C to 85°C. The device is RoHS compliant.

Key Features

• Logic Capacity  74,637 logic elements to implement complex digital functions and custom hardware accelerators.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM (3,170,304 bits) for data buffering, FIFOs, and local storage.
• I/O Resources  280 user I/Os for flexible interfacing with peripherals, sensors, and external devices.
• Package & Mounting  484-BBGA (23×23) supplier package designed for surface-mount assembly and compact PCB layouts.
• Power  Core supply range of 1.14 V to 1.26 V to match target system power architectures.
• Temperature Range  Commercial-grade operation from 0°C to 85°C for standard commercial deployments.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Custom digital systems  Leverage the large logic fabric to implement application-specific processing and control logic.
• High-density I/O interfacing  Use the 280 user I/Os to consolidate peripheral interfaces and buses on a single device.
• Embedded control and signal processing  Combine logic capacity and on-chip RAM to build deterministic control loops and local data processing.
• Prototyping and evaluation  Surface-mount 484-BBGA packaging and substantial resources make the device suitable for board-level prototyping of mid-to-high complexity designs.

Unique Advantages

• High logic density: 74,637 logic elements provide headroom for complex state machines, pipelines, and custom accelerators.
• Substantial on-chip memory: Approximately 3.17 Mbits of RAM reduces reliance on external memory for many buffering and processing tasks.
• Broad I/O capability: 280 user I/Os enable extensive peripheral connectivity without immediate need for additional interface chips.
• Compact, manufacturable package: 484-BBGA (23×23) surface-mount package supports compact PCB designs and automated assembly.
• Low-voltage core: 1.14–1.26 V supply range aligns with low-voltage system architectures.
• Commercial-grade and compliant: Rated for 0°C to 85°C operation and RoHS compliant for standard commercial product lines.

Why Choose XC6SLX75-3FGG484C?

The XC6SLX75-3FGG484C offers a balanced combination of logic capacity, embedded memory, and high I/O count in a compact BGA package from AMD. Its specification profile is aimed at designs that require significant programmable logic and on-chip RAM within a commercial temperature range.

This device is suited to engineering teams and procurement professionals building mid-to-high complexity FPGA solutions who require verifiable technical specifications and RoHS compliance for their commercial products.

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