XC6SLX75-3FG676C

The XC6SLX75-3FG676C is a Spartan®-6 LX field programmable gate array (FPGA) offered in a 676-ball BGA package. It provides a mid-range balance of programmable logic, embedded memory, and I/O density for commercial applications.

With 74,637 logic elements, approximately 3.17 Mbits of embedded memory and 408 user I/Os, this device targets commercial embedded designs that require substantial on-chip resources in a compact surface-mount package.

Key Features

• Core Logic  5,831 CLBs delivering 74,637 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM (3,170,304 total RAM bits) to support buffering, state storage, and local data processing.
• I/O Capacity  408 general-purpose I/O pins to interface with multiple peripherals, buses, and external devices.
• Power  Core supply voltage range from 1.14 V to 1.26 V for the FPGA fabric.
• Package & Mounting  676-ball BGA package (supplier device package: 676‑FBGA, 27×27) designed for surface-mount assembly.
• Operating Range  Commercial-grade temperature rating from 0 °C to 85 °C, suitable for standard commercial environments.
• Compliance  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Used to implement custom logic, protocol handling, and system control in compact commercial electronics.
• Communications Equipment  Suitable for interfacing and packet handling tasks that benefit from substantial I/O and on-chip memory.
• Consumer Electronics  Can be used for feature-rich control, user interface handling, and peripheral aggregation in consumer devices.
• Test & Measurement  Provides programmable logic and local memory for data capture, preprocessing, and custom instrumentation functions.

Unique Advantages

• High logic density: 74,637 logic elements enable complex designs without external logic expansion.
• Ample on-chip memory: Approximately 3.17 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs.
• Large I/O count: 408 I/Os provide flexibility to connect multiple peripherals, buses, and interfaces directly to the FPGA.
• Compact BGA package: 676-ball (27×27) FBGA delivers a small board footprint while preserving large pinout capacity.
• Commercial-grade operation: Rated for 0 °C to 85 °C to match standard commercial deployment requirements.
• Low-voltage core: 1.14 V to 1.26 V supply range aligns with common FPGA core power architectures.

Why Choose XC6SLX75-3FG676C?

The XC6SLX75-3FG676C offers a balanced combination of logic capacity, embedded memory and extensive I/O in a compact 676-BGA package, making it well-suited for commercial designs that require significant on-chip resources without a large board footprint. Its commercial temperature rating and RoHS compliance support standard production and assembly flows.

Choose this Spartan®-6 LX device when your design needs mid-range programmable logic density, multiple interfaces, and embedded RAM to consolidate functionality and reduce external component count while maintaining a surface-mount BGA form factor.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the XC6SLX75-3FG676C.