XC6SLX75-2FGG676I

The XC6SLX75-2FGG676I is a Spartan®-6 LX field programmable gate array (FPGA) designed for applications that require a balance of logic density, embedded memory, and I/O capability in a compact surface-mount package. This industrial-grade device provides a defined set of resources for implementing custom digital logic and interfacing tasks.

Key on-chip resources include 5,831 CLBs, 74,637 logic elements, approximately 3.17 Mbits of embedded memory, and 408 I/O pins. The device is supplied in a 676-BGA footprint (676-FBGA, 27×27), supports a core voltage range of 1.14 V to 1.26 V, and is specified for operation from -40 °C to 100 °C. It is RoHS compliant.

Key Features

• Core Logic 5,831 CLBs providing 74,637 logic elements for implementing complex programmable logic and custom datapaths.
• Embedded Memory Approximately 3.17 Mbits of on-chip RAM to support FIFOs, buffers, and local data storage without external memory.
• I/O and Connectivity 408 I/O pins to support a wide range of peripheral interfacing and parallel or serial signaling requirements.
• Package and Mounting 676-BGA package (supplier device package: 676-FBGA, 27×27) in a surface-mount form factor for compact board integration.
• Power Core voltage specified from 1.14 V to 1.26 V to match system power-rail requirements and ensure predictable operation.
• Temperature and Grade Industrial-grade device rated for operation from -40 °C to 100 °C, suitable for temperature-demanding environments.
• Environmental Compliance RoHS compliant for compliance with lead-free assembly and environmental requirements.

Typical Applications

• Industrial Control — Implement custom control logic, I/O aggregation, and deterministic processing in industrial equipment using the device’s industrial temperature rating and abundant I/O.
• High-density Custom Logic — Leverage 74,637 logic elements and 5,831 CLBs for complex state machines, signal processing blocks, or protocol handling in compact systems.
• Interface and Bridge Functions — Use the large number of I/O pins and on-chip RAM for protocol translation, parallel-to-serial bridging, and buffering between subsystems.

Unique Advantages

• High Logic Density: 74,637 logic elements and 5,831 CLBs enable substantial custom logic implementation without external ASICs or discrete glue logic.
• Integrated On-chip Memory: Approximately 3.17 Mbits of embedded RAM reduce dependence on external memory for buffering and local data storage.
• Robust I/O Capacity: 408 I/O pins provide flexibility for connecting multiple peripherals, buses, and interfaces directly to the FPGA.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact BGA Package: 676-FBGA (27×27) surface-mount package allows high-density PCB implementations while maintaining a manageable footprint.
• RoHS Compliant: Conforms to lead-free requirements for modern assembly and environmental standards.

Why Choose XC6SLX75-2FGG676I?

The XC6SLX75-2FGG676I delivers a practical combination of logic capacity, embedded memory, and I/O resources in a compact 676-BGA package targeted at industrial-grade applications. Its specified voltage range and wide operating temperature make it suitable for designs that require predictable, long-term operation in harsher environments.

This device is well suited to engineers and procurement teams looking for a mid-to-high density FPGA option that balances on-chip resources with a small board footprint and RoHS compliance, enabling reliable deployment in industrial and other temperature-stressed systems.

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